Abstract
A new IGBT module bond wires condition monitoring method is proposed, which realizes the condition monitoring of IGBT module bond wires aging in off-state. The method defines the collector-emitter peak voltage (VCEp) when the IGBT module is turned on as the health indicator, so as to judge the aging state of the bond wires of the IGBT module. Based on theoretical analysis, the changes of gate loop stray inductance and inter-electrode capacitance caused by bond wires cracking and shedding will affect the peak collector-emitter voltage during the turn-on process. In order to eliminate the influence of DC voltage, load current, junction temperature and other factors during the measurement process, the measurement process is carried out in the shutdown state of the inverter system. In addition, a special high-speed peak voltage hold circuit is designed to realize the peak detection of the collector-emitter peak voltage, and the high-speed peak voltage hold circuit is analyzed. The results show that the circuit can effectively identify and maintain the peak value, has reliable performance and fast response speed, and has important guiding significance for the realization of the state monitoring of IGBT modules.
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Zhu, X. et al. (2023). IGBT Module Status Monitoring Method Based on High-Speed Peak Holding. In: Dong, X., Yang, Q., Ma, W. (eds) The proceedings of the 10th Frontier Academic Forum of Electrical Engineering (FAFEE2022). FAFEE 2022. Lecture Notes in Electrical Engineering, vol 1054. Springer, Singapore. https://doi.org/10.1007/978-981-99-3408-9_71
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DOI: https://doi.org/10.1007/978-981-99-3408-9_71
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