Abstract
In wafer–wafer hybrid bonding, maintaining vigorous reliability of bonding and minimal deformation is essential. This paper probes the methodology for different design and process parameters for a two-layer wafer–wafer bonding using the finite element analysis (FEA) methodology. The shortcoming of poor bonding reliability allied with IC design and process parameters is discussed to endorse a better understanding on parameters that could be used to establish strategies for the wafer–wafer hybrid bonding techniques.
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Chaudhuri, D., Rahaman, H., Ghosh, T. (2023). A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding. In: Giri, C., Iizuka, T., Rahaman, H., Bhattacharya, B.B. (eds) Emerging Electronic Devices, Circuits and Systems. Lecture Notes in Electrical Engineering, vol 1004. Springer, Singapore. https://doi.org/10.1007/978-981-99-0055-8_35
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DOI: https://doi.org/10.1007/978-981-99-0055-8_35
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