Abstract
This study aims to establish a parametric-based tool capable of identifying key factors of the complicated manufacturing processes in the semiconductor industry to simplify the calculation of carbon footprint of products (CFP). Development of this methodology for wafer fabrication has been completed. An inventory of carbon emissions from a total of 7,114 samples was conducted, down to each step of process, including all 6-, 8-, and 12-in wafers with six different functions. Several regression models for CFP, which include key parameters, were developed. The results indicate that these regression models can effectively predict the CFP of the wafer fabrication.
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© 2013 Springer Science + Business Media Singapore
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Hu, A.H., Huang, CY., Yin, J., Wang, HC., Wang, TH. (2013). Developing a Parametric Carbon Footprinting Tool: A Case Study of Wafer Fabrication in the Semiconductor Industry. In: Nee, A., Song, B., Ong, SK. (eds) Re-engineering Manufacturing for Sustainability. Springer, Singapore. https://doi.org/10.1007/978-981-4451-48-2_82
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DOI: https://doi.org/10.1007/978-981-4451-48-2_82
Publisher Name: Springer, Singapore
Print ISBN: 978-981-4451-47-5
Online ISBN: 978-981-4451-48-2
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