Abstract
This work reports that the composite channel InGaAs, InAs and InGaAs thin, with dual delta-doped double recessed gate (DG) MOSHEMT, is 40 nm gate length, the barrier 3 nm and 15 nm thick channel, and this structure has been simulated in the TCAD Sentaurus simulation tool. The DC and RF characteristics of proposed device are characterized by different gate lengths along with different VDS. The novel design features included under this proposed structure, namely recessed high stem gate, thin barrier, dual gate, composite channel and the HfO2 as a dielectric material, are applicable for low leakage current along with Tera Hertz frequency applications. The simulation results show the exhibition of a high drain current of 1.38 × 10−3 A/µm, transconductance of 3.35 × 10−3 S/µm, threshold voltage of 0.13 V, cutoff and maximum frequency of oscillation of 791 and 995 GHz by the DGMOSHEMT devices at LG = 40 nm and VDS = 0.5 V. The findings are obtained due to the superior electron transportation properties of a DG MOSHEMT structure with compound semiconductor III-V materials.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Kim TW, Kim DH, del Alamo JA (2009) 30 nm In 0.7 Ga 0.3 As Inverted-Type HEMTs with reduced gate leakage current for logic applications. In: 2009 IEEE international electron devices meeting (IEDM). IEEE, New York, pp 1–4 (2009)
Radhakrishnan SK, BaskaranSubramaniyan M, Nagarajan M (2018) Comparative assessment of InGaAs sub-channel and InAs composite channel double gate (DG)-HEMT for sub-millimeter wave applications. AEU-International Journal of Electronics and Communications 83 (2018): 462–469.
Kim TW, Kim DH, Del Alamo JA (2010) Logic characteristics of 40 nm thin-channel InAs HEMTs. In: 2010 22nd international conference on indium phosphide and related materials (IPRM). IEEE, New York, pp 1–4
Zhou X, Li Q, Tang CW, Lau KM (2012) 30-nm Inverted In0.53Ga0.47As MOSHEMTs on Si Substrate Grown by MOCVD With Regrown Source/Drain. IEEE Electron Device Lett 33(10):1384–1386
Saravana Kumar R, Mohanbabu A, Mohankumar N, Godwin Raj D (2018) Simulation of InGaAssubchannel DG-HEMTs for analogue/RF applications. Int J Electron 105(3):446–456
Yun D-Y, Jo H-B, Son S-W, Baek J-M, Lee J-H, Kim T-W, Kim D-H, Tsutsumi T, Sugiyama H, Matsuzaki H (2018) Impact of the source-to-drain spacing on the DC and RF Characteristics of InGaAs/InAlAs high-electron mobility transistors. IEEE Electron Device Lett 39(12):1844–1847
Kim DH, Del Alamo JA (2010) 30-nm InAs PHEMTs with f T= 644 GHz and f max= 681 GHz. Institute of Electrical and Electronics Engineers.
Kuo CI, Hsu HT, Chang EY, Chang CY, Miyamoto Y, Datta S, Radosavljevic M, Huang G-W, Lee C-T (2008) RF and logic performance improvement of In0. 7Ga0. 3As/InAs/In0. 7Ga0. 3As composite-channel HEMT using gate-sinking technology. IEEE Electron Device Lett 29(4):290–293
Lee KW, Huang JS, Lee FM, Huang YS, Wang Y-H, Su SC, Chao BH, Chen CC (2007) Analytical study of the dc characteristics on the InAlAs/InGaAs metamorphic HEMT with oxidized InGaAs gate. In: 2007 IEEE conference on electron devices and solid-state circuits. IEEE, New York, pp 259–262
Nirmal D, Vijayakumar P, Shruti K, Mohankumar N (2013) Nanoscale channel engineered double gate MOSFET for mixed signal applications using high-k dielectric. Int J Circuit Theory Appl 41(6):608–618
Liu H, Xiong Z, Sin JKO (2003) Implementation and characterization of the double-gate MOSFET using lateral solid-phase epitaxy IEEE Trans Electron Devices 50(6):1552–1555
Mohankumar N, Syamal B, Sarkar CK (2010) Influence of channel and gate engineering on the analog and RF performance of DG MOSFETs. IEEE Trans Electron Devices 57(4):820–826
Poornachandran R, Mohan Kumar N, Saravana Kumar R, Baskaran S (2020) Noise analysis of double gate composite InAs based HEMTs for high frequency applications. Microsyst Technol pp 1–9
Wichmann N, Duszynski I, Bollaert S, Mateos J, Wallart X, Cappy A (2004) 100 nm InAlAs/InGaAs double-gate HEMT using transferred substrate. In: IEDM technical digest. IEEE international electron devices meeting, 2004. IEEE, New York, pp 1023–1026
Mo JJ, Wichmann N, Roelens Y, Zaknoune M, Desplanque L, Wallart X, Bollaert S (2012) Lattice matched and PseudomorphicInGaAs MOSHEMT with fT of 200 GHz. In: 2012 International conference on indium phosphide and related materials. IEEE, New York, pp 44–47
Endoh A, Watanabe I, Mimura T (2012) Monte Carlo simulation of InGaAs/strained-InAs/InGaAs channel HEMTs considering self-consistent analysis of 2-dimensional electron gas. In: 2012 international conference on indium phosphide and related materials. IEEE, New York, pp 48–51
Kim D-H, Del Alamo JA (2010) Scalability of sub-100 nm InAs HEMTs on InP substrate for future logic applications. IEEE Trans Electr Devices 57(7):1504–1511
Vasallo BG, Wichmann N, Bollaert S, Roelens Y, Cappy A, González T, Pardo D, Mateos J (2007) Comparison between the dynamic performance of double-and single-gate AlInAs/InGaAs HEMTs. IEEE Trans Electr Devices 54(11):2815–2822
Sugiyama H, Hoshi T, Yokoyama H, Matsuzaki H (2012) Metal-organic vapor-phase epitaxy growth of InP-based HEMT structures withInGaAs/InAs composite channel. In: 2012 international conference on indium phosphide and related materials. IEEE, New York, pp 245–248
Xue F, Zhao H, Chen Y-T, Wang Y, Zhou F, Lee JC (2011) High-k InGaAs metal-oxide-semiconductor field-effect-transistors with various barrier layer materials. Appl Phys Lett 99(3):033507
Xue F, Zhao H, Chen Y-T, Wang Y, Zhou F, Lee JC (2011) InAs inserted InGaAs buried channel metal-oxide-semiconductor field-effect-transistors with atomic-layer-deposited gate dielectric. Appl Phys Lett 98(8):082106
Chang E-Y, Kuo C-I, Hsu H-T, Chiang C-Y, Miyamoto Y (2013) InAs thin-channel high-electron-mobility transistors with very high current-gain cutoff frequency for emerging submillimeter-wave applications. Appl Phys Express 6(3):034001
Ajayan J, Subash TD, Kurian D (2017) 20 nm high performance novel MOSHEMT on InP substrate for future high speed low power applications. Superlattices Microstruct 109:183–193
Alam MT, Islam SK (2006) A modified model for Si/SiGe MOS-gate delta-doped HEMTs. Microelectron J 37(9):938–942
Kim D-H, del Alamo JA (2009) Scalability of sub-100 nm thin-channel InAs PHEMTs. In: 2009 IEEE international conference on indium phosphide & related materials. IEEE, New York, pp 132–135
Kumar RS, Mohanbabu A, Mohankumar N, Godwin Raj D (2017) In0. 7Ga0. 3As/InAs/In0. 7Ga0. 3As composite-channel double-gate (DG)-HEMT devices for high-frequency applications. J Comput Electron 16(3):732–740
Jie H, Tianyi G, Haiying Z, Jingbo X, Xiaojun F, Hao Y, Jiebin N (2010) 120-nm gate-length In0. 7Ga0. 3As/In0. 52Al0. 48As InP-based HEMT. J Semiconduct 31(7):074008
Fatah F, Kuo C-I, Hsu H-T, Chiang C-Y, Hsu C-Y, Miyamoto Y, Chang EY (2012) Bias-dependent radio frequency performance for 40 nm InAs high-electron-mobility transistor with a cutoff frequency higher than 600 GHz. Japanese J Appl Phys 51(11R):110203
Wu YQ, Xu M, Wang RS, Koybasi O, Ye PD (2009) High performance deep-submicron inversion-Mode InGaAs MOSFETs with maximum G m exceeding 1.1 mS/µm: New HBr pretreatment and channel engineering. In: 2009 IEEE international electron devices meeting (IEDM). IEEE, New York, pp 1–4
Egard M, Ohlsson L, Borg BM, Lenrick F, Wallenberg R, Wernersson L-E, Lind E (2011) High transconductance self-aligned gate-last surface channel In 0.53 Ga 0.47 As MOSFET. In: 2011 international electron devices meeting. IEEE, New York, pp 13–2
Yonai Y, Kanazawa T, Ikeda S, Miyamoto Y (2011) High drain current (> 2A/mm) InGaAs channel MOSFET at V D= 0.5 V with shrinkage of channel length by InP anisotropic etching. In: 2011 international electron devices meeting. IEEE, New York, pp 13–3
Li Q, Zhou X, Tang CW, Lau KM (2013): Material and device characteristics of metamorphic In0.53Ga0.47As MOSHEMTs Grown on GaAs and Si Substrates by MOCVD. IEEE Trans Electron Devices 60(12):4112–4118
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2021 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.
About this paper
Cite this paper
Saravana Kumar, R., Mohankumar, N., Baskaran, S., Poornachandran, R. (2021). Enhanced InGaAs/InAs/InGaAs Composite Channel MOSHEMT Device Performance by Using Double Gate Recessed Structure with HfO2 as Dielectric Materials. In: Sharma, D.K., Son, L.H., Sharma, R., Cengiz, K. (eds) Micro-Electronics and Telecommunication Engineering. Lecture Notes in Networks and Systems, vol 179. Springer, Singapore. https://doi.org/10.1007/978-981-33-4687-1_49
Download citation
DOI: https://doi.org/10.1007/978-981-33-4687-1_49
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-33-4686-4
Online ISBN: 978-981-33-4687-1
eBook Packages: EngineeringEngineering (R0)