Overview
- Addresses chiplet design and heterogeneous integraton packaging both in theory and practice
- Provides studies in design, materials, process, fabrication, and reliability of various chiplet designs
- Written by a veteran in the area
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Table of contents (6 chapters)
Authors and Affiliations
About the author
John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow
Unimicron Technology Corporation, John_Lau@unimicron.com
SPECIALIZED PROFESSIONAL COMPETENCIES
[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.
[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.
[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.
Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.
Bibliographic Information
Book Title: Chiplet Design and Heterogeneous Integration Packaging
Authors: John H. Lau
DOI: https://doi.org/10.1007/978-981-19-9917-8
Publisher: Springer Singapore
eBook Packages: Engineering, Engineering (R0)
Copyright Information: The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2023
Hardcover ISBN: 978-981-19-9916-1Published: 28 March 2023
Softcover ISBN: 978-981-19-9919-2Published: 29 March 2024
eBook ISBN: 978-981-19-9917-8Published: 27 March 2023
Edition Number: 1
Number of Pages: XXII, 525
Number of Illustrations: 42 b/w illustrations, 501 illustrations in colour
Topics: Electronics and Microelectronics, Instrumentation, Circuits and Systems, Nanotechnology and Microengineering