Abstract
In recent years, with the rise and rapid advancement of printed electronics technology in recent years, the fabrication of large-scale, inexpensive, high-precision transistor devices has gradually moved into the center of attention for transistor research. However, there are still some technical bottlenecks in the process of realising the wide application of printed technology in electronic devices. This paper introduces the composition and main structure of transistors, the characteristics and advantages and disadvantages of different printing processes, as well as the materials commonly used for each structure in the preparation of transistors, and reviews the relevant research progress in recent years, and finally looks forward to the development prospects of the printed method for the preparation of transistors.
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Acknowledgements
This research is supported by Beijing Natural Science Foundation (No.2202018), General Project of Beijing Municipal Education Commission Science and Technology Program (No. KM202010015004), Research and development of intelligent packaging for cultural relics(Ed202001), Construction and application transformation of cross media cloud platform for printing and packaging anti-counterfeiting and traceability(27170121005), National Natural Science Foundation of China (No.21604005), the general project of fundamental research of BIGC(No.Eb202001), and the general project of science and technology of Beijing Municipal Education Commission (No.KM202110015008).
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Zhang, N. et al. (2023). Research Progress on Thin Film Transistors Fabricated with Printing Technologies. In: Xu, M., Yang, L., Zhang, L., Yan, S. (eds) Innovative Technologies for Printing and Packaging. CACPP 2022. Lecture Notes in Electrical Engineering, vol 991. Springer, Singapore. https://doi.org/10.1007/978-981-19-9024-3_23
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DOI: https://doi.org/10.1007/978-981-19-9024-3_23
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