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Encapsulation of CNT Films on Silicon Wafer by DLC Synthesized by PECVD for Application as a Thermal Interface Material

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Advances in Micro and Nano Manufacturing and Surface Engineering

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

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Abstract

This research is based on the synthesis of a carbon–carbon multifunctional thin film composite. This nanocomposite involves synthesizing a thin film of diamond-like carbon (DLC) coated on nearly vertically aligned carbon nanotubes using a radio frequency plasma enhanced chemical vapour deposition (RF-PECVD). The carbon nanotubes (CNTs) are synthesized on a silicon substrate using RF-PECVD. DLC is deposited on CNTs for different flow rates of acetylene gas. Studies on morphology, structure of the DLC/CNT nanocomposite is carried out using scanning electron microscope (SEM) and transmission electron microscope (TEM). Raman spectroscopy is used to estimate the sp3 and sp2 content of the 2D nanomaterial. Ansys software simulations are carried out to derive thermal conductivity and heat flux of the nano sandwich into consideration and have values of about 73.59 W/mK and 245 W/mm2, respectively.

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Acknowledgements

The authors thank Mr. Murugan A, Mrs. Sarmistha Dhan, and Mr. Basavaraju, CMTI for assisting in characterization.

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Authors and Affiliations

  1. Central Manufacturing Technology Institute (CMTI), Tumkur Road, Bangalore, 560022, India

    Krishna Ankit, L. S. Aravinda,  Nagahanumaiah, K. Niranjan Reddy & N. Balashanmugam

  2. Vellore Institute of Technology, Vellore, 600097, India

    T. Gecil Evangeline

  3. IIT Tirupati, Tirupati, 517506, India

    Krishna Ankit, N. Sharath Kumar & Mamilla Ravi Sankar

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  1. Krishna Ankit
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  2. T. Gecil Evangeline
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  3. L. S. Aravinda
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Correspondence to Krishna Ankit .

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Editors and Affiliations

  1. Department of Production Engineering, Jadavpur University, Kolkatta, India

    Bijoy Bhattacharyya

  2. Department of Mechanical Engineering, National Institute of Technology, Calicut, Kerala, India

    Jose Mathew

  3. Department of Mechanical Engineering, PSG Institute of Technology and Applied Research, Coimbatore, Tamil Nadu, India

    N. Saravanakumar

  4. Department of Mechanical Engineering, PSG Institute of Technology and Applied Research, Coimbatore, Tamil Nadu, India

    G. Rajeshkumar

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Ankit, K. et al. (2023). Encapsulation of CNT Films on Silicon Wafer by DLC Synthesized by PECVD for Application as a Thermal Interface Material. In: Bhattacharyya, B., Mathew, J., Saravanakumar, N., Rajeshkumar, G. (eds) Advances in Micro and Nano Manufacturing and Surface Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-19-4571-7_9

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  • DOI: https://doi.org/10.1007/978-981-19-4571-7_9

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-19-4570-0

  • Online ISBN: 978-981-19-4571-7

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