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Design and Analysis of High Sensitivity MEMS Microphone

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Advances in Micro and Nano Manufacturing and Surface Engineering

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

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Abstract

This paper presents the design details of MEMS condenser microphone and increasing the sensitivity of it by incorporating slots in the diaphragm. The proposed microphone bears a thickness of 0.75 µm and a diameter of 800 µm. The diaphragm of the microphone is made up of silicon, considering the material properties, tendency for deflection and ease of fabrication. Similarly, Silicon dioxide and Silicon nitride are used as back plate and substrate, respectively. To increase the sensitivity, ‘c’-type slots are introduced in the diaphragm. From the experimental analysis, it was found that diaphragm with slots had 30% more deflection compared to the one without slots. This microphone is designed with the constraints to match the application in stethoscope. The working parameters of the microphone such as diaphragm deflection, sensitivity and capacitance are analyzed using the ANSYS workbench, and the results are tabulated.

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Acknowledgements

The authors would like to thank SVTC department of Central Manufacturing Technology Institute (CMTI), Bengaluru, for providing the facilities for accomplishment of the project.

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Correspondence to K. Nisarga .

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Abraham, J., Sanjeev, H., Nisarga, K. (2023). Design and Analysis of High Sensitivity MEMS Microphone. In: Bhattacharyya, B., Mathew, J., Saravanakumar, N., Rajeshkumar, G. (eds) Advances in Micro and Nano Manufacturing and Surface Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-19-4571-7_10

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  • DOI: https://doi.org/10.1007/978-981-19-4571-7_10

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-19-4570-0

  • Online ISBN: 978-981-19-4571-7

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