Abstract
This paper presents the design details of MEMS condenser microphone and increasing the sensitivity of it by incorporating slots in the diaphragm. The proposed microphone bears a thickness of 0.75 µm and a diameter of 800 µm. The diaphragm of the microphone is made up of silicon, considering the material properties, tendency for deflection and ease of fabrication. Similarly, Silicon dioxide and Silicon nitride are used as back plate and substrate, respectively. To increase the sensitivity, ‘c’-type slots are introduced in the diaphragm. From the experimental analysis, it was found that diaphragm with slots had 30% more deflection compared to the one without slots. This microphone is designed with the constraints to match the application in stethoscope. The working parameters of the microphone such as diaphragm deflection, sensitivity and capacitance are analyzed using the ANSYS workbench, and the results are tabulated.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
A treatise on electricity and magnetism, 3rd edn, vol 2. Oxford, Clarendon, 1892, pp 68–73
AzizollahGanji B, YeopMajlis B (2009) Design and fabrication of a new MEMS capacitive microphone using a perforated aluminum diaphragm. Sens Actuators A 149:29–37
Jerman JH (1990) The fabrication and use of micro machined corrugated silicon diaphragms. In: Proceedings of the 5th international conference on solid state sensors and actuators and euro sensors, vol 23, pp 988–992
Gharaei H, Koohsorkhi J, Saniei F, Abbasi A (2013) Design and characterization of a high sensitive MEMS capacitive microphone using coupled membrane structure. In: First RSI/ISM international conference robotics and mechatronics (ICRoM), pp 374–377
Yang C (2010) The sensitivity analysis of a MEMS microphone with different membrane diameters. J Mar SciTechnol 18:790–796
Scheeper PR, Nordstrand B, Gullov JO, Liu B, Clausen T, Midjord L (2003) A new measurement microphone based on MEMS technology. J Micro Electro MechSyst 6:880–891
Tajima T, Nishiguchi T, Chiba S, Morita A, Abe M (2003) High performance ultra-small single crystalline silicon microphone of an integrated structure. MicroelectronEng 67:508–519
Iguchi Y, Goto M, Iwaki M, Ando A, Tanioka K et al (2007) Silicon microphone with wide frequency range and high linearity. Sens Actuators A 135:420–425
Young M (1989) The technical writer’s handbook. University Science, Mill Valley, CA
Weigold JW, Brosnihan TJ, Bergeron J, Zhang X (2006) A MEMS condenser microphone for consumer applications. In: 19th IEEE international conference on istanbul, micro electro mechanical systems, pp 86–89
Kimori N, Kumai Y, Hishinuma S, Ikehara T (2013) Ten-micrometerthick silicon diaphragm used in condenser microphone. Key Eng Mater Trans Tech Publ 538:277–280
Kiihama¨ki J, Dekker J, Pekko P, Kattelus H, Sillanpa¨a¨ T, Mattila T (2004) A new concept for fabricating SOI MEMS devices. MicrosystTechnol 10:346–350
Kim BH, Lee HS (2015) Acoustical-thermal noise in a capacitive MEMS microphone. IEEE Sens J 15:6853–6860
Ganji BA, Sedaghat SB, Roncaglia A, Belsito L, Ansari R (2018) Design, modeling, and fabrication of crab-shape capacitive microphone using silicon-on-isolator wafer. J Micro Nanolithogr MEMS MOEMS 17:015002
Fuldner M, Dehe A, Lerch R (2005) Analytical analysis and finite element simulation of advanced membranes for silicon microphones. IEEE Sens J 5:857–863
Sedaghat SB, Ganji BA, Ansari R (2018) Design and modeling of a frog-shape MEMS capacitive microphone using SOI technology. MicrosystTechnol 24:1061–1070
Walser S, Siegel, Winter M, Feiertag G, Loibl M, Leidl A (2016) MEMS microphones with narrow sensitivity distribution. Sens Actuators A Phys 247:663–670. https://www.cuidevices.com/blog/comparing-mems-and-electret-condenser-microphones
Acknowledgements
The authors would like to thank SVTC department of Central Manufacturing Technology Institute (CMTI), Bengaluru, for providing the facilities for accomplishment of the project.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2023 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.
About this paper
Cite this paper
Abraham, J., Sanjeev, H., Nisarga, K. (2023). Design and Analysis of High Sensitivity MEMS Microphone. In: Bhattacharyya, B., Mathew, J., Saravanakumar, N., Rajeshkumar, G. (eds) Advances in Micro and Nano Manufacturing and Surface Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-19-4571-7_10
Download citation
DOI: https://doi.org/10.1007/978-981-19-4571-7_10
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-19-4570-0
Online ISBN: 978-981-19-4571-7
eBook Packages: EngineeringEngineering (R0)