Abstract
Continuous miniaturization of the engineering applications and growing demand for their performance require an effective and compact cooling system. Boiling flow or evaporating flow has excellent potential to fulfill those requirements. Boiling flow transfers three to four times more heat compared to a single-phase flow system, mainly due to the formation of the liquid film and energy consumption in the form of latent heat. So, to understand heat transfer in boiling flow, the present work focuses on an extensive study of the flow field and temperature field for boiling flow in a slug flow regime for a typical microchannel. In addition to highly resolved experiments, the numerical modeling of boiling heat transfer has been established as a fundamental tool for research during the last decade. One such method for evaporation phenomena based on the kinetic theory of gases is implemented in the non-isothermal, incompressible two-phase flow solver using in-house code. Present work contains a detailed description of the model and comprehensive information about its validation. Furthermore, the detailed analysis of the simulation results clarifies the mechanism and flow dynamics that can lead to the improvement of a microchannel’s heat transfer rate.
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Chaudhari, N., Shah, N., Banerjee, J. (2023). Numerical Analysis of Vapor Bubble Influence on the Flow and Temperature Field in Slug Flow Regime of Microchannel. In: Banerjee, J., Shah, R.D., Agarwal, R.K., Mitra, S. (eds) Recent Advances in Fluid Dynamics . Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-19-3379-0_38
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DOI: https://doi.org/10.1007/978-981-19-3379-0_38
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