Abstract
With the rapid development of renewable energy, power conversion systems play a vital role in the new energy grid. In this paper, aiming at the power unit of power conversion system based on SiC MOSFET, which includes 10 kV high voltage AC module and 750 V low voltage DC module, the low inductance design and heat dissipation design methods of the power unit are emphatically studied, and the overall design scheme of the power unit is proposed. By optimizing the structure of laminated bus, the stray inductance of high voltage AC module and low voltage DC module is reduced to 794 μH and 235 μH respectively, which effectively reduces the turn-off overvoltage of power unit. Through the thermal simulation analysis, the heat dissipation scheme of forced air cooling is established, and the required radiator and fan are designed, so that the maximum temperature of the device in the operation process would not exceed 50 ℃. Finally, the prototype of the power unit is built and the towing experiment is carried out, which verifies the effectiveness of the optimization design of the laminated bus structure and the heat dissipation design scheme of the power unit.
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References
Gu, L.: Summary of research on single-stage high-frequency isolated three-phase bidirectional AC/DC converter. Proc. CSEE, 1–16 (2021). https://doi.org/10.13334/j.0258-8013.pcsee.201524
Roscoe, N.M., Zhong, Y., Finney, S.J.: Comparing SiC MOSFET IGBT and Si MOSFET in LV distribution inverters. In: Industrial Electronics Society IECON 2015-41st Annual Conference of the IEEE (2015)
Wei, T., Li, W., Yang, Y., Yu, S., He, Z.: Design of 10kV SiC flexible DC power conversion unit. Guangdong Electric Power 33(08), 27–35 (2020)
Li, Z., Gao, F., Zhao, C., et al.: Research summary of power electronic transformer technology. Proc. CSEE 38(5), 1274–1289 (2018)
Moongilan, D.: Skin-effect modeling of image plane techniques for radiated emissions from PCB traces [C]. In: IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, USA (1997)
Yi, R., Zhao, Z.: Study on IGCT turn-off characteristics in large-capacity converter affected by stray inductance. Proc. CSEE 27(31), 115–120 (2007)
Gao, Q.: Research on H-bridge inverter power unit using laminated bus. Dalian University of Technology (2015)
Niu, Y.: Research on low inductance design and heat dissipation of inverter main circuit for electric bus. China Jiliang University (2015)
Chen, M., Mao, B., Chen, Y., Wang, X.: Application of low inductance busbar technology in IGBT converter. High Power Converter Technol. 06, 14–17 (2012)
Du, L.: Research on power module structure of intermittent pulse high current power converter. China Ship Research Institute (2018)
Caponet, M.C., Profumo, F., De Doncker, R.W., Tenconi, A.: Low stray induction bus bar design and construction for good EMC performance in power electronic circuit. IEEE Trans. Power Electron. 17(2), 225–231 (2002)
Zhong, H.: Development of power unit in air-cooled high-power high-voltage frequency converter. Shanghai Jiaotong University (2012)
Zheng, R.: Development and application of medium voltage test platform for SiC MOSFET power module. Zhejiang University (2019)
Lu, Z.: Research on full-bridge combined DC/DC conversion technology with dual-mode control. Zhejiang University (2017)
Acknowledgments
This work is partially supported by the China Southern Power Grid (GDKJXM20193412).
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Xie, N., Zhao, Y., Zhao, W., Yue, J., Wang, W., Zhang, C. (2022). Design Method for Power Unit of Power Conversion System Based on SiC MOSFET. In: Yang, Q., Liang, X., Li, Y., He, J. (eds) The proceedings of the 16th Annual Conference of China Electrotechnical Society. Lecture Notes in Electrical Engineering, vol 889. Springer, Singapore. https://doi.org/10.1007/978-981-19-1528-4_39
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DOI: https://doi.org/10.1007/978-981-19-1528-4_39
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