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Structure Design of a Spaceborne Module

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Proceedings of the Eighth Asia International Symposium on Mechatronics

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 885))

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Abstract

This paper introduces the design of a space borne module. The design process of the module is divided into three aspects: structural design, thermal design and anti-mechanical environment design. The feasibility of the structure design is verified by the analysis and calculation of thermal simulation and mechanical simulation software.

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References

  1. Yang, S., Tao, W.: Heat Transfer Theory. Higher Education Press, Beijing (1998)

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  2. Qiu, C.: Structure Design of Electronic Equipment. Southeast University Press (2002)

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Correspondence to Zhehao Chen .

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Chen, Z., Zhang, J., Wu, C. (2022). Structure Design of a Spaceborne Module. In: Duan, B., Umeda, K., Kim, Cw. (eds) Proceedings of the Eighth Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 885. Springer, Singapore. https://doi.org/10.1007/978-981-19-1309-9_127

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