Abstract
The strict power restrictions of integrated circuits and the non-scalability of the subthreshold slope in a metal-oxide semiconductor field-effect transistor (MOSFET) present major challenges to the continuous scaling of field-effect transistors. Henceforth, tunnel field-effect transistors (Tunnel FETs) have been deemed an optimistic contender to substitute the well-known conventional MOSFET as they possess a steep subthreshold slope lower than 60 mV/decade along with its fast switching characteristics at a low operating power supply voltage. Despite numerous advantages, the performance of the tunnel FET primarily relies on the accuracy in the manufacturing procedure. Ion implantation techniques have been employed to comprehend the variations in non-zero tilting angle. This extends the dopants from the source as well as drain regions into the channel region and affects the performances of tunnel FET significantly. Using Technology Computer Aided Design (TCAD) simulations, detailed examination on the impact of variations in lateral straggling parameters (σ) for a hetero-stacked source tunnel FET (HSS-TFET) is carried out. The chapter focuses on the investigation of Analog/RF figure of merits of the HSS-TFET due to lateral straggling variations. A mixed-mode HSS-tunnel FET is analyzed by the implementation of a digital HSS-tunnel FET inverter for variations in the straggling parameter.
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References
Kahng D (1976) A historical perspective on the development of MOS transistors and related devices. IEEE Trans Electron Devices 23:655–657
Brinkman WF, Haggan DE, Troutman WW (1997) A history of the invention of the transistor and where it will lead us. IEEE J Solid-State Circ 32:1858–1865
Mack CA (2011) Fifty years of Moore’s law. IEEE Trans Semicond Manuf 24:202–207
Zhang Q, Zhao W, Seabaugh A (2006) Low-subthreshold-swing tunnel transistors. IEEE Electron Device Lett 27:297–300
Ionescu AM, Riel H (2011) Tunnel field-effect transistors as energy-efficient electronic switches. Nature 479:329–337
Lu H, Seabaugh A (2014) Tunnel field-effect transistors: State-of-the-art. J. Electron Devices Soc 44–49
Koswatta SO, Lundstrom MS (2009) Performance comparison between p-i-n tunneling transistors and conventional MOSFETs. IEEE Trans Electron Devices 56:456–465
Knoch J, Appenzeller J (2005) A novel concept for field-effect transistors: The tunneling carbon nanotube FET. In: Proceedings of 63rd DRC. IEEE, pp 153–156
Knoch J, Appenzeller J (2008) Tunneling phenomena in carbon nanotube field-effect transistors. Physica Status Solidi (a) 205(4):679–694
Choi WY, Park BG, Lee JD, Liu TJK (2007) Tunneling field-effect transistors (TFETs) with subthreshold swing (SS) less than 60 mV/dec. IEEE Electron Device Lett 28:743–745
Taur Y, Ning TH (1998) Fundamentals of modern VLSI devices. Cambridge University Press, Cambridge, UK
Khatami Y, Banerjee K (2009) Steep subthreshold slope n- and p-type tunnel-FET devices for low-power and energy-efficient digital circuits. IEEE Trans Electron Devices 56:2752–2761
Lee M, Jeon Y, Son KS, Shim JH, Kim S (2012) Comparative performance analysis of silicon nanowire tunnel FETs and MOSFETs on plastic substrates in flexible logic circuit applications. Physica Status Solidi (a) 209(7):1350–1358
International Technology Roadmap for Semiconductors (ITRS (2013) Emerging research devices, 2013 edn. http://www.itrs.net
Verhulst AS, Vandenberghe WG, Leonelli D, Rooyackers R, Vandooren A, Pourtois G, Gendt SD, Heyns MM, Groeseneken G (2010) Boosting the on-current of Si-based tunnel field-effect transistors. ECS Trans 33(6):363–372
Bhushan B, Nayak K, Rao VR (2012) DC compact model for SOI tunnel field-effect transistors. IEEE Trans Electron Devices 59(10):2635–2642
Toh EH, Wang GH, Yeo GSYC (2007) Device physics and design of double-gate tunneling field-effect transistor by silicon film thickness optimization. Appl Phys Lett 90(263507)
Liu L, Mohata D, Datta S (2012) Scaling length theory of double-gate interband tunnel field-effect transistors. IEEE Trans. on Electron Devices 59(4):902–908
Verhulst AS, Sorée B, Leonelli D, Vandenberghe WG, Groeseneken G (2010) Modeling the single-gate, double-gate, and gate-all-around tunnel field-effect transistor. J Appl Phys 107:024518-1-024518–6
Zhan A, Mei J, Zhang L, He H, He J, Chan M (2012) Numerical study on dual material gate nanowire tunnel field-effect transistor. In: International conference on electron devices and solid-state circuit (EDSSC), Bangkok, Thailand, 3–5 Dec 2012
Vishnoi R, Kumar MJ (2014) Compact analytical drain current model of gate-all around nanowire tunneling FET. IEEE Trans Electron Devices 61(7):2599–2603
Bohr MT, Chau RS, Ghani T, Mistry K (2007) The High-k Solution. IEEE Spectr 44(10):29–35
Boucart K, Ionescu AM (2007) Double-gate tunnel FET with high-κ gate dielectric. IEEE Trans Electron Devices 54:1725–1733
Schlosser M, Bhuwalka K, Sauter M, Zilbauer T, Sulima T, Eisele I (2009) Fringing-induced drain current improvement in the tunnel field-effect transistor with high-κ gate dielectrics. IEEE Trans Electron Devices 56:100–108
Anghel C, Chilagani P, Amara A, Vladimirescu A (2010) Tunnel field effect transistor with increased ON current, low-κ spacer and high-κ dielectric. Appl Phys Lett (122104)
Jhaveri R, Nagavarapu V, Woo J (2011) Effect of pocket doping and annealing schemes on the source-pocket tunnel field-effect transistor. IEEE Trans Electron Devices 58:80–86
Verreck D, Verhulst AS, Kao KH, Vandenberghe WG, Meyer KD, Groeseneken G (2013) Quantum mechanical performance predictions of p-n-i-n versus pocketed line tunnel field-effect transistors. IEEE Trans Electron Devices 60:2128–2134
Abdi BD, Kumar MJ (2014) In-built N+ pocket p-n-p-n tunnel field-effect transistor. IEEE Electron Device Lett 35:1170–1172
Agopian PGD, Martino MDV, Santos SD et al (2015) Influence of the source composition on the analog performance parameters of vertical nanowire-TFETs. IEEE Trans Electron Devices 61:16–22
Toh EH, Wang GH, Samudra G, Yeo YC (2008) Device physics and design of germanium tunneling field-effect transistor with source and drain engineering for low power and high performance applications. J. Applied Physics 103(104504)
Verhulst AS, Vandenberghe WG, Maex K, Groeseneken G (2007) Tunnel field-effect transistor without gate-drain overlap. Appl Phys Lett 91(053102)
Alam K, Takagi S, Takenaka M (2014) A Ge ultrathin-body n-channel tunnel FET: effects of surface orientation. IEEE Trans Electron Devices 61:3594–3600
Chander S, Baishya S (2015) A two-dimensional gate threshold voltage model for a heterojunction SOI-tunnel FET with oxide/source overlap. IEEE Electron Device Lett 36(7):714–716
Kim SH, Jacobson ZA, Liu TJK (2010) Impact of body doping and thickness on the performance of germanium-source TFETs. IEEE Trans Electron Devices 57(7):1710–1713
Goswami R, Bhowmick B (2017) An analytical model of drain current in a nanoscale circular gate TFET. IEEE Trans. on Electron Devices 64(1):45–51
Saha R, Bhowmick B, Baishya S (2019) Impact of WFV on electrical parameters due to high-k/metal gate in SiGe channel tunnel FET. Microelectron Eng 214:1–4
Mitra SK, Bhowmick B (2018) A compact interband tunneling current model of gate-on source/channel SOI-TFET. J Comput Electron 17(4):1557–1566
Wu C, Huang Q, Zhao Y et al (2016) A novel tunnel FET design with stacked source configuration for average subthreshold swing reduction. IEEE Trans Electron Devices 63(12):5072–5076
Shockley W (1957) Forming Semiconductive devices by ionic bombardment. US Patent 2,787,564, 2 April 1957
Mayer JW, Eriksson L, Davies JA (1970) Ion implantation in semiconductors. Academic Press, New York
Ziegler JF (1992) Ion implantation technology. North Holland Amsterdam
Kranti A, Armstrong GA (2007) Source/drain extension region engineering in FinFETs for low-voltage analog applications. IEEE Electron Device Lett 28(2):139–141
Rimini E (1995) Ion implantation: Basics to Device Fabrication. Springer Science+Business Media, New York
Gosh S, Kolen K, Sarkar CK (2015) Impact of the lateral straggle on the analog and RF performance of TFET. Microelectron Reliab 55:326–331
Vanlalawmpuia K, Saha R, Bhowmick B (2018) Performance evaluation of heterostacked TFET for variation in lateral straggle and its application as digital inverter. Appl Phys A: Mater Sci Process 124(10):701. https://doi.org/10.1007/s00339-018-2121-4
Saha R, Vanlalawmpuia K, Bhowmick B, Baishya S (2019) Deep insight into DC, RF/analog, and digital inverter performance due to variation in straggle parameter for gate modulated TFET. Mater Sci Semicond Process 91:102–107. https://doi.org/10.1016/j.mssp.2018.11.011
Ziegler JF (1992) Handbook of ion implantation technology. Elsevier Science Publications, p 119
Kranti A, Armstrong GA (2007) Design and optimization of FinFETs for ultra-low-voltage analog applications. IEEE Trans Electron Devices 54(12):3308–3316
Sentaurus Device Users’ Manual (2013) Synopsys Inc. Mountain View, CA, USA
Biswas A, Dan SS, Royer C, Grabinski W, Ionescu AM (2012) TCAD simulation of SOI TFETs and calibration of non-local band-to-band tunneling model. Microelectron Eng 98:334–337
Trivedi AR, Carlo S, Mukhopadhyay S (2013) Exploring tunnel-FET for ultra-low power analog applications: a case study on operational transconductance amplifier. In: Proceedings of the 50th annual design automation conference, IEEE, p 109
Hoyniak D, Nowak E, Anderson RL (2000) Channel electron mobility dependence on lateral electric field in field-effect transistors. J Appl Phys 87:876–881
Yang Y, Tong X, Yang LT, Guo PF, Fan L, Yeo YC (2010) Tunneling field-effect transistor: capacitance components and modeling. IEEE Electron Device Lett 31:752–754
Dagtekin N, Ionescu AM (2015) Impact of super-linear onset, off-region due to uni-directional conductance and dominant CGD on performance of TFET-based circuits. IEEE J Electron Devices Soc 3:233–239
Mookerjea S, Krishnan R, Datta S, Narayanan V (2009) On enhanced Miller capacitance effect in interband tunnel transistors. IEEE Electron Device Lett 30:1102–1104
Mallik A, Chattopadhyay A (2012) Tunnel field-effect transistors for analog/mixed-signal system-on-chip applications. IEEE Trans. on Electron Devices 59:888–894
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Vanlalawmpuia, K., Bhowmick, B. (2022). Lateral Straggle Parameter and Its Impact on Hetero-Stacked Source Tunnel FET. In: Goswami, R., Saha, R. (eds) Contemporary Trends in Semiconductor Devices. Lecture Notes in Electrical Engineering, vol 850. Springer, Singapore. https://doi.org/10.1007/978-981-16-9124-9_8
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DOI: https://doi.org/10.1007/978-981-16-9124-9_8
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