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A Study of Electrodeposited Gold Thin Films Using a Confocal Laser Scanning Microscope

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Recent Trends in Electrochemical Science and Technology

Abstract

Electrochemical deposition is a promising method for obtaining metallic coatings on the surfaces by precisely controlling current and voltage over two electrodes in a plating bath. In the present research work, gold thin film is deposited on an aluminum alloy specimen from a cyanide-based electroplating bath. The report describes plating sequences for pre-treatment, including cleaning, zincating, electroless nickel plating, and gold plating by Direct Current (DC), Pulse Current (PC), and Pulsed Reverse Current (PRC) methods to produce thin films. Optimization of process parameters is carried out for PRC plating. During PC and PRC deposition, the effect of various parameters on the surface roughness of the gold thin film is studied using the confocal laser microscope (CLM). The advantages of PRC plating methods over DC method are described and demonstrated. The surface morphology and surface roughness of the gold deposited specimens by both the processes are compared by analyzing them using CLM. Experiments are done for a suitable choice of the PC and PRC parameters to enable gold to electrodeposit with the least surface roughness.

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Acknowledgements

The authors appreciate the technical help received from colleagues during the course of experiments reported in this paper. The authors gratefully acknowledge the inspiration received from Shri Jaimin Desai, Group Director, EnTSG. SRA/PMQD-M team, for testing support and regards to reviewers for spending their valuable time in the evaluation. Sincere thanks to Shri A. Bhattacharya, DD ESSA, and Director-SAC for their kind approval of this paper.

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Correspondence to Vaishali Umrania .

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Umrania, V., Shukla, S. (2022). A Study of Electrodeposited Gold Thin Films Using a Confocal Laser Scanning Microscope. In: Mudali, U.K., Aruna, S.T., Nagaswarupa, H.P., Rangappa, D. (eds) Recent Trends in Electrochemical Science and Technology. Springer Proceedings in Materials, vol 15. Springer, Singapore. https://doi.org/10.1007/978-981-16-7554-6_7

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