The Simplest Method to Determine Cure Kinetics

Abstract

Dynamic differential scanning calorimetry (DSC) experiments of a single part epoxy paste adhesive SY-H2 were performed at multiple heating rates (β) ranging from 1.25 to 160 K/min. Test results of DSC were analyzed in different ways, which the initial cure temperature (T_i), the onset temperatures (T_onset), peak temperatures (T_p) and the finishing temperature (T_f) of DSC curves were both taken into consideration to calculate the apparent activation energy (E_a). Based on changes of the onset temperatures or peak temperatures (expressed as T*) with different heating rate (β), a linear equation, $T^{*} = T_{1} + \Delta Tln{\upbeta }$, has been obtained to determine the curing temperature parameters more reasonably. The above equation can be used to explain some laws of higher or lower of apparent activation energies (E_a), by which the apparent activation energy (E_a) nearly equals to $RT_{1}^{2} /\Delta T$.