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Gap-Coupled Microstrip Antenna Backed by Rectangular Slots Cut Ground Plane for Enhanced Bandwidth

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Proceedings of International Conference on Wireless Communication

Part of the book series: Lecture Notes on Data Engineering and Communications Technologies ((LNDECT,volume 92))

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Abstract

A novel gap-coupled rectangular microstrip antenna backed by rectangular slots cut ground plane is proposed. The slots are placed on the ground plane below each of the fed and parasitic patches such that the TM30 ground mode frequency of the antenna is altered, thereby giving a wideband response. The proposed antenna yields larger bandwidth and comparable gain value with reference to the conventional un-slotted gap-coupled antenna operating at the same frequency. The impedance bandwidth of 365 MHz (12.84%), the peak gain of 6 dBi, is achieved. Thus, the proposed gap-coupled design offers 47% bandwidth improvement as compared to the gap-coupled design with the normal ground plane.

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Author information

Authors and Affiliations

  1. SVKM’s EXTC Department, DJSCE, Mumbai, India

    Poonam A. Kadam & Amit A. Deshmukh

Authors
  1. Poonam A. Kadam
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  2. Amit A. Deshmukh
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Editor information

Editors and Affiliations

  1. Dwarkadas J. Sanghvi College of Engineering, Mumbai, Maharashtra, India

    Hari Vasudevan

  2. Department of Electrical and Computer Engineering, Rutgers, The State University of New Jersey, New Brunswick, NJ, USA

    Zoran Gajic

  3. Dwarkadas J. Sanghvi College of Engineer, Mumbai, Maharashtra, India

    Amit A. Deshmukh

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© 2022 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

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Kadam, P.A., Deshmukh, A.A. (2022). Gap-Coupled Microstrip Antenna Backed by Rectangular Slots Cut Ground Plane for Enhanced Bandwidth. In: Vasudevan, H., Gajic, Z., Deshmukh, A.A. (eds) Proceedings of International Conference on Wireless Communication. Lecture Notes on Data Engineering and Communications Technologies, vol 92. Springer, Singapore. https://doi.org/10.1007/978-981-16-6601-8_3

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  • DOI: https://doi.org/10.1007/978-981-16-6601-8_3

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-16-6600-1

  • Online ISBN: 978-981-16-6601-8

  • eBook Packages: EngineeringEngineering (R0)

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