An Experimental Investigation on Adhesivity of Modified Epoxy at Different Curing Temperature

Abstract

According to the experimental findings, the inclusion of reinforcing materials results in a major change. The reinforcement material used differed significantly, and the study was supplemented by deciding how much of an impact it might have on the performance of the Aluminum joints. The tensile strength of the epoxy combined with nano clay and pineapple fiber used in this study was tested against a variety of reinforcing materials at various concentrations and found to be superior in terms of curing temperature and varying surface property. The samples were made on Aluminum plates with standard dimensions of 250 mm long, 25 mm high, and 3 mm thick to assess the bond strength of the modified epoxy sample. This study concludes that, in most situations, curing time is an important factor in achieving optimum bond efficiency, which improves with the inclusion of reinforcing materials. Aluminum samples were adhered to the plates using an adhesive bonding procedure and then left in place with resin poured between the plates. samples have been prepared and characterized, and results were reported. The adhesive density of NE for “rough (scratched) sample” has increased by up to 63.34% over the standard sample, 60.25% over the smooth sample, and 7.2% over the normal samples at RT. Both specimens have different surface roughness (i.e., normal, smooth, rough) and curing temperatures (i.e., room temperature and 100 °C). The findings of lap adhesive strength measurements of stress on bonded joints prepared with epoxy comprising various fillers in this experiment were obtained using load–displacement diagrams.