Abstract
MNC’s has introduced a Self-driven two-wheeler in the metropolitan cities, so that vehicle consists of numerous electronics and the major patented is self-control through smartphones. The most important electronic PCB board is embedded in an enclosure. The industry develops the enclosure design and production implementation with the help of Solid works, the 3D enclosure was designed into tow sub-assemblies, one is cover part and another one is the PCB carrier. The material for enclosure was selected as per IPC standards. (PA66 30%GF). The enclosure was also designed as self-locking even without screw. The fasteners (TWIN FAST SCEW) were selected as per the IPC standards. The metal to non-metal torque rate was analyzed and selected as per requirements. The mechanical endurance such as Hardness test and Salt Spray Test were conducted for the selection of screw. The enclosure was produced using Hot injection molding process.
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Thirumalai, R., Seenivasan, M., Sivakumar, A., Vivekraj, M., Balaji, V. (2022). Instrument Cluster IoT Enclosure Design and Production Implementation in Self Driven Vehicles. In: Ibrahim, R., K. Porkumaran, Kannan, R., Mohd Nor, N., S. Prabakar (eds) International Conference on Artificial Intelligence for Smart Community. Lecture Notes in Electrical Engineering, vol 758. Springer, Singapore. https://doi.org/10.1007/978-981-16-2183-3_20
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DOI: https://doi.org/10.1007/978-981-16-2183-3_20
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