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Low Loss Dielectric Materials

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Semiconductor Advanced Packaging

Abstract

Semiconductor industry has identified five major growth engines (applications) [1, 2]: (1) mobile such as smartphones, smartwatches, notebooks, wearables, tablets, etc., (2) high-performance computing (HPC), also known as supercomputing, which is able to process data and perform complex calculations at high speeds on a supercomputer, (3) autonomous vehicle (or self-driving cars), (4) IoTs (internet of things) such as smart factory and smart health, and (5) big data (for cloud computing) and instant data (for edge computing).

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Authors and Affiliations

  1. Unimicron Technology Corporation, Taoyuan, Taiwan

    John H. Lau

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  1. John H. Lau
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Correspondence to John H. Lau .

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Lau, J.H. (2021). Low Loss Dielectric Materials. In: Semiconductor Advanced Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-16-1376-0_10

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  • DOI: https://doi.org/10.1007/978-981-16-1376-0_10

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  • Print ISBN: 978-981-16-1375-3

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