Abstract
Yield is a key indicator in the SMT manufacturing process. To solve the traditional experience-oriented quality control method, we put forward a quality traceability system for SMT. The system includes two parts: firstly, the carrier identification and estimation module, which is used to solve the problem that the production resume cannot be established because of costs and the bar code equipment cannot be set up in the continuous production environment; secondly the quality traceability system, which is used to track the quality under the interaction of more than 300 factors, such as steel plate, solder paste quality, scraper speed, suction nozzle pressure, and temperature condition of each area of the oven. In fact, the system has been operating in the actual production line of SMT, and assisting in the tracking of defective products in the manufacturing process.
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References
Zhen, H., Q. Ershi, and L. Zixian. 2000. Quality improvement through SPC/DOE in SMT manufacturing. In: Proceedings of the 2000 IEEE International Conference on Management of Innovation and Technology. ICMIT 2000. ‘Management in the 21st Century’ (Cat. No. 00EX457).
Kwuan, Jeffrey Len Yung, Leon Rao, Evan Yip, Wisdom Qu, and Jonas Sjoberg. 2019. Impact of Stencil Quality and Technology on Solder Paste Printing Performance, 2019 Pan Pacific Microelectronics Symposium (Pan Pacific).
Kamen, E.W., A. Goldstein, D.R. Creveling, E. Sahinci, Z. Xiong. 1998. Analysis of factors affecting component placement accuracy in SMT electronics assembly. In: Twenty Third IEEE/CPMT International Eelectronics Manufacturing Technology Symposium (Cat. No. 98CH36205), pp. 50–57, Austin, TX, USA.
Li, Chun-quan, and Zhao-hua Wu. 2006. SPC system analysis and design of reflow soldering process. In 2006 7th International Conference on Electronic Packaging Technology.
Li, Chun-quan; and Zhao-hua Wu. 2005. Process management system analysis and design of SMT reflow soldering process. In: 2005 6th International Conference on Electronic Packaging Technology.
Wohlrabe, Heinz, Thomas Herzog, and Klaus-Jurgen Wolter. 2008. Optimization of SMT solder joint quality by variation of material and reflow parameters. In 2008 2nd Electronics System-Integration Technology Conference.
Svasta, P., D. Simion-Zanescu, and C. Willi. 2002. Thermal conductivity influence in SMT reflow soldering process. In: 52nd Electronic Components and Technology Conference 2002. (Cat. No. 02CH37345).
Data Science Ninja, The balance: Accuracy versus Interpretability. https://www.datascienceninja.com/2019/07/01/the-balance-accuracy-vs-interpretability/.
Sirikulviriya, N., and S. Sinthupinyo. 2011. Integration of rules from a random forest. In: Proceedings of the 2011 International Conference on Information and Electronics Engineering, pp. 194–198.
Phung, L.T.K., V.T.N. Chau, and N.H. Phung. 2015. Extracting rule RF in educational data classification: From a random forest to interpretable refined rules. In: 2015 International Conference on Advanced Computing and Applications (ACOMP), pp. 20–27. Ho Chi Minh City.
Mashayekhi M., and R. Gras. 2015. Rule extraction from random forest: The RF+HC methods. In: Advances in artificial intelligence. Canadian AI 2015. Lecture Notes in Computer Science, vol. 9091, ed. D. Barbosa, E. Milios, pp. 223–237. Cham: Springer.
Ronan, Gautier, Gregoire Jafre, and Bibi Ndiaye. 2018. Interpretabbility with diversified-by-design rules; SKOPE-RULEs, A Python Package. https://2018.ds3-datascience-polytechnique.fr/wp-content/uploads/2018/06/DS3-309.pdf.
Acknowledgements
This study is conducted under the “Technology of Quality Decision-making support in Intelligent Manufacturing (3/4)” of the Institute for Information Industry which is subsidized by the Ministry of Economic Affairs of the Republic of China.
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Chen, CH., Hsieh, DW., Wu, CH., Lai, CY., Hsieh, CC. (2021). Quality Traceability System for Multistation SMT Manufacturing Process. In: Chang, JW., Yen, N., Hung, J.C. (eds) Frontier Computing. FC 2020. Lecture Notes in Electrical Engineering, vol 747. Springer, Singapore. https://doi.org/10.1007/978-981-16-0115-6_8
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