Abstract
The paper presents the study of phase change material for the cooling of electronic components. The phase change material (PCM) used in the study is eicosane. Thermal conductivity enhancers (TCEs), made of aluminum, are used in order to alter the low thermal conductive nature of PCM. The TCEs are divided into no fin heat sink, constant height plate heat sink, and dual-height plate heat sink. Three power inputs of 4, 6, and 8 W are used for the study. Thermal cooling capacity by all the three heat sinks setups is compared. The effect of parameters such as power input and volume of PCM is also discussed. Results indicate that the power input level and the volume of PCM are important factors that influence the thermal management of electronic components. The use of 5 dual-height plate fin heat sink elongates the charging period of the PCM filled setup, thereby maintaining the device temperature within a favorable limit for a longer duration, as compared to the no fin heat sink and 5 constant height plate fin heat sink.
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Acknowledgements
The authors acknowledged the financial support from MHRD. We are grateful to our institute as well as our Department of Mechanical engineering, NERIST, for all possible help. We also acknowledged SAIC, Tezpur University and TRTC, Guwahati, for their support in the work.
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Singh, M.R., Giri, A., Lingfa, P. (2021). Effect of Dual-Height Plate Fins on Phase Change Material Cooling Technique: An Experimental Study. In: Pandey, K., Misra, R., Patowari, P., Dixit, U. (eds) Recent Advances in Mechanical Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-15-7711-6_62
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DOI: https://doi.org/10.1007/978-981-15-7711-6_62
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