Abstract
In the packaging industry, the conventional lead-based solders have gradually become obsolete because of Hazardous Substances regulations and the rapid advancement of alternatives in microelectronics production. Sintered silver paste is proposed to bond the chips and substrates, because compared with other metals used in the electronic industry, silver has better thermal and electrical conductivity, a higher melting point, and it has less susceptible to oxidation. However, after sintering, a considerable pore fraction will be existing in the material, and compared with bulk silver, after the sintering process the material density decreases. Therefore, the effect of the pore distribution on elastic and thermal properties of the sintered silver pastes during aging is one of the main parameters for modeling the whole electronic system under operating conditions. So far, there are limited studies for investigating the effect of the material aging on the microstructural level. Hence, this study focuses on examining the effect of the morphology and pore distribution in the material responses as well as determining the quantitative nanostructure relationship between the material properties of the as-sintered and aged. In this study, a home-built MATLAB® code was developed in order to increase the quality of images. Mimics® software was used to convert the images to solid 3D representative volume elements. Numerical homogenization technique was also used to evaluate as-sintered and aged microstructure properties. The results show that there is a temporary pattern relationship between the stress and the time of the heat treatment. To validate the developed model, both as-sintered and aged materials have gone through several published work to determine changes of the material properties.
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References
Bai JG, Zhang ZZ, Calata JN, Lu G-Q (2006) Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material. IEEE Trans Compon Packag Technol 29:589–593
Scheuermann U (2009) Reliability challenges of automotive power electronics. Microelectron Reliab 49:1319–1325
Ghoushji M, Alebrahim R, Zulkifli R, Sulong A, Abdullah S, Azhari C (2018) Crashworthiness characteristics of natural ramie/bio-epoxy composite tubes for energy absorption application. Iran Polym J, 1–13
Schwarzbauer H (1989) Method of securing electronic components to a substrate. Google Patents
Schwarzbauer H (1990) Method and apparatus for fastening electronic components to substrates. Google Patents
Schwarzbauer H (1991) Apparatus for fastening electronic components to substrates. Google Patents
Schwarzbauer H, Kuhnert R (1989) Novel large area joining technique for improved power device performance. In: Industry applications society annual meeting. Conference record of the 1989. IEEE, pp 1348–1351
Smet V, Jamal M, Waldron F, Stam F, Mathewson A, Razeeb KM (2013) High-temperature die-attach technology for power devices based on thermocompression bonding of thin Ag films. IEEE Trans Compon Packag Manuf Technol 3:533–542
Heuck N, Müller S, Palm G, Bakin A, Waag A (2010) Swelling phenomena in sintered silver die attach structures at high temperatures: reliability problems and solutions for an operation above 350 C. Additional Papers and Presentations 2010:000018–000025
Heuck N, Palm G, Sauerberg T, Stranz A, Waag A, Bakin A (2010) SiC-die-attachment for high temperature applications. In: Materials science forum, pp 741–744
Siow KS (2012) Mechanical properties of nano-silver joints as die attach materials. J Alloy Compd 514:6–19
Rajaguru P, Lu H, Bailey C (2015) Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectron Reliab 55:919–930
Wang D, Mei Y-H, Xie H, Zhang K, Siow KS, Li X et al (2017) Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material. Mater Lett 206:1–4
Chua S, Siow KS (2016) Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 C. J Alloy Compd 687:486–498
Siow KS (2014) Are sintered silver joints ready for use as interconnect material in microelectronic packaging? J Electron Mater 43:947–961
Alebrahim R, Sharifishourabi G, Sharifi S, Alebrahim M, Zhang H, Yahya Y et al (2018) Thermo-mechanical behaviour of smart composite beam under quasi-static loading. Composite structures
Meyghani B, Awang M, Bokam P, Plank B, Heinzl C, Siow K (2019) Finite element modeling of nano porous sintered silver material using computed tomography images. Materialwiss Werkstofftech 50:533–538
Goldsmid HJ (2014) Bismuth telluride and its alloys as materials for thermoelectric generation. Materials 7:2577–2592
Kähler J, Stranz A, Waag A, Peiner E (2014) Thermoelectric coolers with sintered silver interconnects. J Electron Mater 43:2397–2404
Panin A, Shugurov A, Oskomov K (2005) Mechanical properties of thin Ag films on a silicon substrate studied using the nanoindentation technique. Phys Solid State 47:2055–2059
Chen C, Nagao S, Suganuma K, Jiu J, Sugahara T, Zhang H et al (2017) Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices. Acta Mater 129:41–51
Zhao Y, Mumby-Croft P, Jones S, Dai A, Dou Z, Wang Y et al (2017) Silver sintering die attach process for IGBT power module production. In: Applied power electronics conference and exposition (APEC). IEEE, pp 3091–3094
Kähler J, Heuck N, Palm G, Stranz A, Waag A, Peiner E (2011) Low-pressure sintering of silver micro-and nanoparticles for a high temperature stable pick & place die attach. In: Microelectronics and packaging conference (EMPC), 18th European, pp 1–7
Carr J, Milhet X, Gadaud P, Boyer SA, Thompson GE, Lee P (2015) Quantitative characterization of porosity and determination of elastic modulus for sintered micro-silver joints. J Mater Process Technol 225:19–23
Buj-Corral I, Vivancos-Calvet J (2013) Improvement of the manufacturing process of abrasive stones for honing. Int J Adv Manuf Technol 68:2517–2523
Meyghani B, Awang M, Emamian S, Plank B, Heinzl C, Siow K (2019) Stress analysis of nano porous material using computed tomography images. Materialwiss Werkstofftech 50:234–239
Acknowledgments
The authors would like to acknowledge the fellowship of the government of China, Shandong University from the International Postdoctoral Exchange Program and the Universiti Teknologi PETRONAS (UTP), Malaysia for the financial support from YUTP-FRG grant cost center 0153AA-H18. Moreover, the authors would like to thank Professor Wallace Kaufman for his endless support.
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Meyghani, B., Emamian, S., Awang, M., Wu, C.S. (2020). Finite Element Modeling of Nano Porous Sintered Silver Material. In: Emamian, S.S., Awang, M., Yusof, F. (eds) Advances in Manufacturing Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-15-5753-8_6
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DOI: https://doi.org/10.1007/978-981-15-5753-8_6
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