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Dynamic Thermal Modeling and Simulation of Boiling Heat Transfer in PCM-Assisted Diverging Microchannels

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Recent Asian Research on Thermal and Fluid Sciences

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

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Abstract

Micro-miniaturization has open up new challenges in negotiating high heat flux in electronics cooling applications. A heat sink design using a diverging fluid passage surrounded by latent heat storage is analyzed. A dynamic thermal model based on energy balance among multiple heat-transfer modes is developed. Solution of this model is used to analyze the thermal behavior when the system is subjected to rapid changes in load or operating parameters. Results of the simulations indicates that the PCM storages in diverging channels help to protract the boiling heat-transfer conditions compared to the straight microchannel. Present configuration offers passive control of rapid temperature development in coolant and chip surface.

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Abbreviations

C :

Capacitance

c :

Specific heat

D h :

Hydraulic diameter

h :

Convective heat-transfer coefficient

k :

Thermal conductivity

L c :

Corrected length of fin

l :

Height of rectangular microchannel

n :

Number of channels

R :

Resistance

s :

Spacing between fins

T :

Temperature

t f :

Thickness of fin

W :

Thickness

α :

Aspect ratio of channel

ρ :

Density

η :

Efficiency of fin

∞ :

Ambient

c :

Channel

e :

External

f :

Fluid

PCM:

Phase changing material

ONB:

Onset of boiling

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Author information

Authors and Affiliations

  1. School of Engineering, Cochin University of Science and Technology, Kochi, 682022, India

    B. Indulakshmi & G. Madhu

Authors
  1. B. Indulakshmi
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  2. G. Madhu
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Corresponding author

Correspondence to B. Indulakshmi .

Editor information

Editors and Affiliations

  1. Department of Mechanical Engineering, College of Engineering Trivandrum, Trivandrum, India

    Abhilash Suryan

  2. School of Mechanical Engineering, Korea Maritime and Ocean University, Busan, Korea (Republic of)

    Deog Hee Doh

  3. Department of Mechanical Systems Engineering, University of the Ryukyus, Okinawa, Nishihara, Japan

    Minoru Yaga

  4. Department of Fluid Engineering, Zhejiang Sci-Tech University, Xiasha Higher Education Zone, Hangzhou, China

    Guang Zhang

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Indulakshmi, B., Madhu, G. (2020). Dynamic Thermal Modeling and Simulation of Boiling Heat Transfer in PCM-Assisted Diverging Microchannels. In: Suryan, A., Doh, D., Yaga, M., Zhang, G. (eds) Recent Asian Research on Thermal and Fluid Sciences. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-15-1892-8_36

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  • DOI: https://doi.org/10.1007/978-981-15-1892-8_36

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-15-1891-1

  • Online ISBN: 978-981-15-1892-8

  • eBook Packages: EngineeringEngineering (R0)

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