Abstract
Pre-bond testing of through silicon vias (TSVs) in 3D ICs is very challenging task. Reliability and correctness of 3D ICs consisting of numbers of TSVs have to be established. This paper presents an innovative pre-bond test method for TSVs in a 3D IC. The logic is devised around the cascadable arrangement of Cellular Automata (CA), discovered by von Neumann in the year of 1960. SACA, a designated class of CA, has been developed to diagnose conductor and insulator defects in TSVs. The segmentation of CA in the design assures more effectiveness, with respect to the number of computations to identify faulty TSVs. The implemented hardware realizes quick test of manufacturing TSV faults in the pre-bond phase.
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References
Pavlidis, F., Friedman, E.G.: Interconnect-based design methodologies for three-dimensional integrated circuits. Proc. IEEE 97(I), 123–140 (2009)
Mariniseen, E.J., Zorian, Y.: Testing 3D chips containing through silicon vias . In: International Test Conference, vol. E1.1 (2009)
Chakraborty, B., Dalui, M.: A cellular automata based test scheme for TSVs in 3D ICs. In: ICDCS, pp. 723–727 (2012)
Chen, P.-Y., Cheng, W., Kwai, D.-M.: On-chip TSV testing for 3D IC before bonding using sense amplification. In: Proceedings of IEEE Asian Test Symposium, pp. 450–455 (2009)
Wolfram, S.: Cellular Automata and Complexity—Collected Papers. Addison Wesley (1994)
Chaudhuri, P.P., Roy, D., Chowdhury, S., Nandi, S., Chatterjee, S.: Additive Cellular Automata–Theory and Applications, vol. 1. IEEE Computer Society Press, California, USA. ISBN 0-8186-7717-1 (1997)
Sukanta, D., Nazma, N.N., Sukanya, M., Mamata, D., Biplab, K.S.: Characterization of CA Rules For SACA Targeting Detection of Faulty Nodes in WSN. ACRI (2010)
Marinissen, E.J., Verbree, J., Konijnenburg, M.: A structured and scalable test access architecture for TSV-based 3D stacked ICs. In: Proceedings of Test Symposium, pp. 269–274, May 2010
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Chakraborty, B., Dalui, M. (2019). Pre-bond Testing of TSVs in 3D IC Using Segmented Cellular Automata. In: Chandra, P., Giri, D., Li, F., Kar, S., Jana, D. (eds) Information Technology and Applied Mathematics. Advances in Intelligent Systems and Computing, vol 699. Springer, Singapore. https://doi.org/10.1007/978-981-10-7590-2_9
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DOI: https://doi.org/10.1007/978-981-10-7590-2_9
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