Abstract
Mechanical behavior of micro- and nanoscale materials has received considerable attention in recent years because of their widespread use in micro−/nanotechnology applications. These materials are also intriguing from a scientific standpoint because their small-size scale results in mechanical behavior that is significantly different from the behavior of macroscale materials. As a result, a variety of experimental methodologies have been developed to accurately determine the mechanical properties (modulus, strength, fracture toughness, etc.) of micro- and nanoscale materials and uncover the microscopic mechanisms that lead to those properties. Among these approaches, microelectromechanical systems (MEMS)-based platforms have proven to be highly suitable because of their capability to apply and resolve extremely small forces (nN) and displacements (nm). In addition, MEMS-based testing platforms, because of their small size, are ideal for in situ characterization in electron and scanning probe microscopes, which often have stringent space limitations. This chapter provides an overview of the development and advances in MEMS-based materials characterization with an emphasis on in situ techniques. Different actuation and sensing mechanisms as well as device configurations for various types of testing (tensile, fatigue, thermomechanical) are reviewed. Key results and insights obtained from the nanomechanical characterization of thin films, nanowires, and nanotubes using MEMS-based platforms are summarized. Finally, some of the challenges and opportunities for MEMS-based micro- and nanoscale materials characterization are discussed.
References
Tang WC, Nguyen T-CH, Howe RT. Laterally driven polysilicon resonant microstructures. Sensors Actuators. 1989;20(1):25–32.
Zhu Y, Chang T-HA. Review of microelectromechanical systems for nanoscale mechanical characterization. J Micromech Microeng. 2015;25(9):93001.
Huang Q-A, Lee NKS. Analysis and design of polysilicon thermal flexure actuator. J Micromech Microeng. 1999;9(1):64.
Que L, Park J-S, Gianchandani YB. Bent-beam electrothermal actuators-part I: single beam and cascaded devices. J Microelectromech Syst. 2001;10(2):247–54.
Guan C, Zhu Y. An electrothermal microactuator with Z-shaped beams. J Micromech Microeng. 2010;20(8):85014.
Abbas K, Alaie S, Leseman ZC. Design and characterization of a low temperature gradient and large displacement thermal actuators for in situ mechanical testing of nanoscale materials. J Micromech Microeng. 2012;22(12):125027.
Haque MA, Espinosa HD, Lee HJ. MEMS for in situ testing – handling, actuation, loading, and displacement measurements. MRS Bull. 2010;35(5):375–81.
Haque MA, Saif MTA. In-situ tensile testing of nano-scale specimens in SEM and TEM. Exp Mech. 2002;42(1):123–8.
Gianola DS, Eberl C. Micro- and nanoscale tensile testing of materials. JOM. 2009;61(3):24–35.
Sharpe WN Jr, Turner KT, Edwards RL. Tensile testing of polysilicon. Exp Mech. 1999;39(3):162–70.
Hemker KJ, Sharpe WN, Microscale J. Characterization of mechanical properties. Annu Rev Mater Res. 2007;37(1):93–126.
Gianola DS, Van Petegem S, Legros M, Brandstetter S, Van Swygenhoven H, Hemker KJ. Stress-assisted discontinuous grain growth and its effect on the deformation behavior of nanocrystalline aluminum thin films. Acta Mater. 2006;54(8):2253–63.
Gianola DS, Sedlmayr A, Mönig R, Volkert CA, Major RC, Cyrankowski E, et al. In situ nanomechanical testing in focused ion beam and scanning electron microscopes. Rev Sci Instrum. 2011;82(6):63901.
Singh SS, Sarkar R, Xie H-X, Mayer C, Rajagopalan J, Chawla N. Tensile behavior of single-crystal tin whiskers. J Electron Mater. 2014;43(4):978–82.
Brown JJ, Baca AI, Bertness KA, Dikin DA, Ruoff RS, Bright VM. Tensile measurement of single crystal gallium nitride nanowires on MEMS test stages. Sensors Actuators A Phys. 2011;166(2):177–86.
Greil J, Lugstein A, Zeiner C, Strasser G, Bertagnolli E. Tuning the electro-optical properties of germanium nanowires by tensile strain. Nano Lett. 2012;12(12):6230–4.
Read DT, Dally JW. A new method for measuring the strength and ductility of thin films. J Mater Res. 1993;8(7):1542–9.
Guo H, Chen K, Oh Y, Wang K, Dejoie C, Syed Asif SA, et al. Mechanics and dynamics of the strain-induced M1–M2 structural phase transition in individual VO2 nanowires. Nano Lett. 2011;11(8):3207–13.
Oh Y, Cyrankowski E, Shan Z, Asif SAS. Micro/nano-mechanical test system employing tensile test holder with push-to-pull transformer [Internet]. US8434370 B2, 2013 [cited 2016 Nov 21]. Available from: http://www.google.com/patents/US8434370.
Haque MA, Saif MTA. In situ tensile testing of nanoscale freestanding thin films inside a transmission electron microscope. J Mater Res. 2005;20(7):1769–77.
Han JH, Saif MTA. In situ microtensile stage for electromechanical characterization of nanoscale freestanding films. Rev Sci Instrum. 2006;77(4):45102.
Desai AV, Haque MA. Test bed for mechanical characterization of nanowires. J Nanoengineering Nanosystems. 2005;219(2):57–65.
Desai AV, Haque MA. Mechanical properties of ZnO nanowires. Sensors Actuators A Phys. 2007;134(1):169–76.
Naraghi M, Chasiotis I, Kahn H, Wen Y, Dzenis Y. Novel method for mechanical characterization of polymeric nanofibers. Rev Sci Instrum. 2007;78(8):85108.
Naraghi M, Chasiotis I, Kahn H, Wen Y, Dzenis Y. Mechanical deformation and failure of electrospun polyacrylonitrile nanofibers as a function of strain rate. Appl Phys Lett. 2007;91(15):151901.
Zhu Y, Moldovan N, Espinosa HD. A microelectromechanical load sensor for in situ electron and x-ray microscopy tensile testing of nanostructures. Appl Phys Lett. 2005;86(1):13506.
Zhu Y, Espinosa HD. An electromechanical material testing system for in situ electron microscopy and applications. PNAS. 2005;102(41):14503–8.
Zhang D, Breguet JM, Clavel R, Sivakov V, Christiansen S, Michler J. In situ electron microscopy mechanical testing of silicon nanowires using electrostatically actuated tensile stages. J Microelectromech Syst. 2010;19(3):663–74.
Pantano MF, Bernal RA, Pagnotta L, Espinosa HD. Multiphysics design and implementation of a microsystem for displacement-controlled tensile testing of nanomaterials. Meccanica. 2014;50(2):549–60.
Hosseinian E, Pierron ON. Quantitative in situ TEM tensile fatigue testing on nanocrystalline metallic ultrathin films. Nanoscale. 2013;5(24):12532–41.
Dai S, Zhao J, Xie L, Cai Y, Wang N, Zhu J. Electron-beam-induced elastic–plastic transition in Si nanowires. Nano Lett. 2012;12(5):2379–85.
Zheng K, Wang C, Cheng Y-Q, Yue Y, Han X, Zhang Z, et al. Electron-beam-assisted superplastic shaping of nanoscale amorphous silica. Nat Commun. 2010;1:1(3):1–8.
Sarkar R, Rentenberger C, Rajagopalan J. Electron beam induced artifacts during in situ TEM deformation of nanostructured metals. Sci Rep. 2015;5:16345.
Bufford DC, Stauffer D, Mook WM, Syed Asif SA, Boyce BL, Hattar K. High cycle fatigue in the transmission electron microscope. Nano Lett. 2016;16(8):4946–53.
Chang T-H, Zhu Y. Microelectromechanical system for thermomechanical testing of nanostructures. Appl Phys Lett. 2013;103(26):263114.
Kang W, Saif MTA. A novel SiC MEMS apparatus for in situ uniaxial testing of micro/nanomaterials at high temperature. J Micromech Microeng. 2011;21(10):105017.
Sim G-D, Park J-H, Uchic MD, Shade PA, Lee S-B, Vlassak JJ. An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope. Acta Mater. 2013;61(19):7500–10.
Agrawal R, Peng B, Gdoutos EE, Espinosa HD. Elasticity size effects in ZnO nanowires−a combined experimental-computational approach. Nano Lett. 2008;8(11):3668–74.
Zhu Y, Qin Q, Xu F, Fan F, Ding Y, Zhang T, et al. Size effects on elasticity, yielding, and fracture of silver nanowires: in situ experiments. Phys Rev B. 2012;85(4):045443.
Rajagopalan J, Han JH, Saif MTA. Plastic deformation recovery in freestanding Nanocrystalline aluminum and gold thin films. Science. 2007;315(5820):1831–4.
Wei X, Kysar JW. Residual plastic strain recovery driven by grain boundary diffusion in nanocrystalline thin films. Acta Mater. 2011;59(10):3937–45.
Lonardelli I, Almer J, Ischia G, Menapace C, Molinari A. Deformation behavior in bulk nanocrystalline-ultrafine aluminum: in situ evidence of plastic strain recovery. Scr Mater. 2009;60(7):520–3.
Rajagopalan J, Han JH, Saif MTA. Bauschinger effect in unpassivated freestanding nanoscale metal films. Scr Mater. 2008;59(7):734–7.
Qin Q, Yin S, Cheng G, Li X, Chang T-H, Richter G, et al. Recoverable plasticity in penta-twinned metallic nanowires governed by dislocation nucleation and retraction. Nat Commun. 2015;6:5983.
Jonnalagadda KN, Chasiotis I, Yagnamurthy S, Lambros J, Pulskamp J, Polcawich R, et al. Experimental investigation of strain rate dependence of nanocrystalline Pt films. Exp Mech. 2010;50(1):25–35.
Karanjgaokar NJ, C-S O, Lambros J, Chasiotis I. Inelastic deformation of nanocrystalline au thin films as a function of temperature and strain rate. Acta Mater. 2012;60(13–14):5352–61.
Izadi E, Rajagopalan J. Texture dependent strain rate sensitivity of ultrafine-grained aluminum films. Scr Mater. 2016;114:65–9.
Zener C. Elasticity and anelasticity of metals. Chicago: University of Chicago Press; 1948.
Cheng G, Miao C, Qin Q, Li J, Xu F, Haftbaradaran H, et al. Large anelasticity and associated energy dissipation in single-crystalline nanowires. Nat Nanotechnol. 2015;10(8):687–91.
Kang W, Saif MTA. In situ study of size and temperature dependent brittle-to-ductile transition in single crystal silicon. Adv Funct Mater. 2013;23(6):713–9.
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Rajagopalan, J. (2018). Microelectromechanical Systems (MEMS)-Based Testing of Materials. In: Schmauder, S., Chen, CS., Chawla, K., Chawla, N., Chen, W., Kagawa, Y. (eds) Handbook of Mechanics of Materials. Springer, Singapore. https://doi.org/10.1007/978-981-10-6855-3_45-1
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