Abstract
At HSG-IMAT the precision assembly of micro systems became increasingly important in recent years. The challenge is to reach a high accuracy of about 10 μm between the assembled elements. At the same time it is important that the applied processes are suitable for low cost manufacturing. Attempts were made to achieve these requirements by means of automatic assembly processes based on MID and PCB. The results of the development at HSG-IMAT are shown in this contribution using the example of an optical module of a rotary encoder. Thereby, the assembly of the laser diode and lens requires special attention to achieve the specified positioning tolerances.
Chapter PDF
Similar content being viewed by others
Keywords
References
Schaeffler, K.G.: Magnetisch versus optisch; Winkel-Mess-Systeme für Rundtischachsen im Vergleich (2008), http://www.schaeffler.com
Hopp, D.: Inkrementale und absolute Kodierung von Positionssignalen diffraktiver optischer Drehgeber; Dissertation Universität Stuttgart (2012)
AiF-Vorhaben Nr. 219 ZN: Untersuchungen zu einem hochauflösenden optischen Drehwinkelsensor in Low-Cost-Bauweise; Institut für Mikroaufbautechnik; Hahn-Schickard-Gesellschaft (2008)
AiF-Vorhaben Nr. 349 ZN: Untersuchungen zu kostengünstigen absolut und inkremental kodierten optischen Drehgebern mit justagefreier Endmontage und mikrostrukturierter diffraktiver Maßverkörperung aus Kunststoff; Institut für Mikroaufbautechnik; Hahn-Schickard-Gesellschaft (2012)
Forschungsvereinigung 3-D MID e.V.: 3D-MID Technologie. München, Carl Hanser Verlag (2004)
Die Attachment and Fluid Dispensing; Brochure; SPT Roth Ltd. (2013), http://www.smallprecisiontools.com
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2014 IFIP International Federation for Information Processing
About this paper
Cite this paper
Seybold, J., Kessler, U., Fritz, KP., Kück, H. (2014). Precision Micro Assembly of Optical Components on MID and PCB. In: Ratchev, S. (eds) Precision Assembly Technologies and Systems. IPAS 2014. IFIP Advances in Information and Communication Technology, vol 435. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-45586-9_5
Download citation
DOI: https://doi.org/10.1007/978-3-662-45586-9_5
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-45585-2
Online ISBN: 978-3-662-45586-9
eBook Packages: Computer ScienceComputer Science (R0)