Skip to main content

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 287))

Abstract

At present, qualitative and quantitative analyses of the soil microstructure are mainly made on the two-dimensional level. The present study makes possible the three-dimensional visualization of soil microstructure by transforming the scanning electron microscopy (SEM) photographs into the three-dimensional digital map (DEM) with such abundant information as their inherent particles and apertures; it also makes available 2.560 as the fractal dimension for the DEM image of the sample soil by conducting a quantitative analysis of its microstructure with the projective covering method, a surface fractal measurement method.

An erratum to this chapter is available at 10.1007/978-3-642-53778-3_66

An erratum to this chapter can be found at http://dx.doi.org/10.1007/978-3-642-53778-3_66

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 169.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Similar content being viewed by others

References

  1. Yuan H (2008) Research of indoor test and microstructure of loess collapsibility. Taiyuan University of Technology, Taiyuan (in Chinese)

    Google Scholar 

  2. Huang Y (2010) Research on 3D reconstruction of clayey soil microstructure image based on SEM. Southwest Jiaotong University, Chengdu (in Chinese)

    Google Scholar 

  3. Y Jiang, Y Wang, S Wang (2011) Realization of 3D reconstruction of expansive soil CT image in Matlab environment. J Southwest Jiaotong Univ 33(3):144–147 (in Chinese)

    Google Scholar 

  4. Peng Z, Wang S (2009) Study of rock and soil CT image reconstruction method. The conference proceeding of the 11th independent innovation and sustainable growth of annual conference of China association for science and technology, vol 2, pp 253–256. (in Chinese)

    Google Scholar 

  5. Li Q, Bao S (2003) Research on 3D reconstruction of microscopic image gray soil. J Anyang Normal Univ. (in Chinese)

    Google Scholar 

  6. Wang B, Zhang M, Shi B (2010) Research of to the principle of viscous soil grain orientation scanning electron microscopy (SEM) images based on the gradient of slope. Chin J Rock Mech Eng 29:2951–2957

    Google Scholar 

  7. Wang B, Zhang M, Shi B (2004) Fractal study on microstructure of clayey soil based on GIS. Chin J Rock Mech Eng 26(2):244–247 (in Chinese)

    Google Scholar 

  8. Xie H, Wang JA, Stein E (1998) Direct fractal measurement and multifractal properties of fracture surface. Phys Lett A 242:41–50

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Yukun Guo .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2014 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Guo, Y., Wang, Z. (2014). A Study of the Three-Dimensional Visualization of Soil Microstructure Based on MATLAB. In: Jia, L., Liu, Z., Qin, Y., Zhao, M., Diao, L. (eds) Proceedings of the 2013 International Conference on Electrical and Information Technologies for Rail Transportation (EITRT2013)-Volume I. Lecture Notes in Electrical Engineering, vol 287. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-53778-3_24

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-53778-3_24

  • Published:

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-53777-6

  • Online ISBN: 978-3-642-53778-3

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics