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Temperature Distribution Measurement for the Comprehension of the Interaction Phenomena Between the Shock Wave and the DC Discharged Field

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31st International Symposium on Shock Waves 1 (ISSW 2017)

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Abstract

The temperature deduction method from the visualization data using the correlation between the shock wave velocity and the temperature was investigated and compared with the rotational temperature measured by the emission spectroscopy. The temperature deduced from the visualization data in the case with the discharge (31.9 [W]) was 800 [K] which was significantly higher than that (300 [K]) in the case without the discharge (0 [W]). However, there was discrepancy with the temperature obtained from the emission spectroscopy. In spite of this discrepancy, with some improvement, the temperature deduction method can be a promising method, since this method can deduce the temperature in the region where even the emission signal is weak and cannot determine the temperature from the emission spectroscopy.

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References

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Authors and Affiliations

  1. Meijo University, Nagoya, Aichi, Japan

    Kenji Okada, Kohei Suwata, Takuhiro Kito & Atsushi Matsuda

  2. DENSO TECHNO Co., Ltd, Obu, Aichi, Japan

    Shinji Koizumi

Authors
  1. Kenji Okada
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  2. Kohei Suwata
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  3. Takuhiro Kito
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  4. Atsushi Matsuda
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  5. Shinji Koizumi
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Corresponding author

Correspondence to Kenji Okada .

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Editors and Affiliations

  1. Department of Aerospace Engineering, Nagoya University, Nagoya, Japan

    Akihiro Sasoh

  2. Department of Energy and Environmental Engineering, Kyushu University, Kasuga, Fukuoka, Japan

    Toshiyuki Aoki

  3. Institute of Innovative Research, Tokyo Institute of Technology, Tokyo, Japan

    Masahide Katayama

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Okada, K., Suwata, K., Kito, T., Matsuda, A., Koizumi, S. (2019). Temperature Distribution Measurement for the Comprehension of the Interaction Phenomena Between the Shock Wave and the DC Discharged Field. In: Sasoh, A., Aoki, T., Katayama, M. (eds) 31st International Symposium on Shock Waves 1. ISSW 2017. Springer, Cham. https://doi.org/10.1007/978-3-319-91020-8_138

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  • DOI: https://doi.org/10.1007/978-3-319-91020-8_138

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-91019-2

  • Online ISBN: 978-3-319-91020-8

  • eBook Packages: EngineeringEngineering (R0)

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