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Characterization of PCBs from Obsolete Computers Aiming the Recovery of Precious Metals

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Characterization of Minerals, Metals, and Materials 2018 (TMS 2018)

Abstract

The massive application of electrical and electronic equipments increased the production and industry development, which leads to a rising environmental and economic problem: the increase of e-waste’s generation. The main cause to explain this problem is the combination between the diversification of electric and electronic device’s applications and programmed obsolescence, which promotes a high generation the so-called waste electrical and electronic equipments (WEEE ). Printed circuit boards (PCBs ) are present in almost all WEEE and their heterogenous composition have a considerable amount of metals, including some precious ones. It is necessary to think about viable alternatives for the destination of WEEE , mostly PCBs’ . Recycling is an environmental friendly purpose for PCBs’ destination, combined with economic advantage from the recovery of metals. The choice of correct process to recycling depends on the composition of the PCBs , so the correct characterization is required. This work aims to characterize two different PCBs from obsolete computers: motherboard and memory board, concluding that they have 35.5 and 18.92% of metals, respectively, including precious metals as silver and gold. Also, memory board has 0.122% of these precious metals to the detriment of 0.047% from motherboard.

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Acknowledgements

The authors gratefully acknowledge the financial support given by Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) through master grant (131479/2017-2).

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Correspondence to Mariana Alves de Carvalho .

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© 2018 The Minerals, Metals & Materials Society

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de Carvalho, M.A., Caldas, M.P.K., Tenório, J.A.S., Espinosa, D.C.R. (2018). Characterization of PCBs from Obsolete Computers Aiming the Recovery of Precious Metals. In: Li, B., et al. Characterization of Minerals, Metals, and Materials 2018 . TMS 2018. The Minerals, Metals & Materials Series. Springer, Cham. https://doi.org/10.1007/978-3-319-72484-3_16

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