Skip to main content
SpringerLink
Log in

Electromagnetic Shielding for RF and Microwave Packages

  • Chapter
  • First Online:
RF and Microwave Microelectronics Packaging II

Abstract

Antennas and electromagnetic radiation helped mankind to invent radio, TV, GPS, wireless communication, and many other advanced and convenient technologies that are taken for granted in daily life. Just for a moment, imagine the world without radiation phenomena, a world without antennas and wireless communication. It would be a world without cellphones, TVs, radios, radar and satellite communication to assist in navigating the sky and oceans, a world in the 1800s. Intentional radiation is necessary to make mobile communication possible; however, unintentional radiation is an obstacle to wireless and wired communications, destructive to electronic systems, and harmful to health.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
eBook
USD 16.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 99.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 129.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Greenberry, Eve. An activist’s journey to raise awareness about electromagnetic pollution part 1, part 2, http://electromagnetichealth.org/wp-content/uploads/2011/01/Explore-Part-I-Final-with-OK.pdf.

  2. http://ec.europa.eu/growth/sectors/electrical-engineering/emc-directive/.

  3. Kenneth Keenan, R. 1983. Digital design for interference specifications.

    Google Scholar 

  4. Dash, Glen. EMI: why digital devices radiate, http://glendash.com/downloads/electromagnetics/as-published/Why_Devices_Radiate_AP.pdf, pp. 4–7.

  5. Hofhiens, Jared. Antennas an introductory guide, http://www.idc-online.com/technical_references/pdfs/electronic_engineering/Antennas_an%20Introductory%20Guide_20061128.pdf, p. 7.

  6. Dash, Glen. A Dash of Maxwell’s: a Maxwell’s Equations Primer, Part Two, pp. 2–10.

    Google Scholar 

  7. Fujimoto, Kyohei, and Morishita Hisashi. Modern Small Antennas, Cambridge University Press, p. 389.

    Google Scholar 

  8. Massachusetts Institute of Technology, The Method of Moments in Electromagnetics, 6.635 lecture notes.

    Google Scholar 

  9. A tutorial on the method of moments. 2012. IEEE Antennas and Propagation Magazine 54(3): 260–275. https://www.researchgate.net/publication/260515353_A_Tutorial_on_the_Method_of_Moments.

  10. Software analysis simulation methods, RADIOING.com—eEngineer, http://www.radioing.com/eengineer/methods.html.

  11. Yee, Kane. 1966. Numerical solution of initial boundary value problems involving Maxwell’s equations in isotropic media. IEEE Transactions on Antennas and Propagation 14(3): 302–307.

    Article  MATH  Google Scholar 

  12. Dash, Glen. Computational magic and the EMC engineer, http://glendash.com/Dash_of_EMC/Computational_Magic/Computational_Magic.pdf.

  13. Rumpf, R.C. 2012. Simple implementation of arbitrarily shaped total-field/scattered-field regions in finite-difference frequency-domain. Progress in Electromagnetics Research B 36: 221–248.

    Article  Google Scholar 

  14. Guide to metal plating. http://www.weldguru.com/metal-plating.html.

  15. Morris, Scott, and Schonthal Eric. Shielding RF components at the package level, https://hubslide.com/rrpipkin/wp-shielding-rf-components-at-the-package-level-2-s5758263f390ab8e8461b2e0d.html.

  16. Tummala, Rao R., et al. 1997. Microelectronics packaging handbook. 2nd ed, 674. Springer.

    Google Scholar 

  17. Christiansen, Donald. 1996. Electronics Engineers’ Handbook, 4th edition. McGraw-Hill. Chapter 11. p. 25.

    Google Scholar 

  18. Paul, C.R. 1992. Introduction to electromagnetic compatibility. A Wiley-Interscience Publication.

    Google Scholar 

  19. Karim, N., J. Mao, and J. Fan. 2010. Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution, 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, Beijing.

    Google Scholar 

  20. Frenzel, Lou. 2012. What’s the difference between EM near field and far field?, Electronic design. http://electronicdesign.com/energy/what-s-difference-between-em-near-field-and-far-field#2.

  21. He, Hui. The development of near field probing systems for EMC near field visualization and EMI source localization, summer 2015, Missouri S&T, Rolla, MO.

    Google Scholar 

  22. Karim, Nozad, Rong, Zhou, and Jun, Fan. An innovative package EMC solution using a highly cost-effective sputtered conformal shield. In IMAPS2016, 12th International Conference and Exhibition on Device Packaging, Fountain Hills, AZ, March 2016.

    Google Scholar 

Download references

Acknowledgement

The authors wish to thank the EMC Laboratory, Missouri University of Science and Technology, and Rong Zhou, Jingun Mao, JinSeong Kim and Ben Zarkoob at Amkor Technology, for building the test samples, technical support, and measurements.

Author information

Authors and Affiliations

  1. Amkor Technology, Tempe, Arizona, USA

    Nozad Karim

Authors
  1. Nozad Karim
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Nozad Karim .

Editor information

Editors and Affiliations

  1. Torrey Hills Technologies, LLC, San Diego, California, USA

    Ken Kuang

  2. Azusa Pacific University, Azusa, California, USA

    Rick Sturdivant

Rights and permissions

Reprints and permissions

Copyright information

© 2017 Springer International Publishing AG

About this chapter

Cite this chapter

Karim, N. (2017). Electromagnetic Shielding for RF and Microwave Packages. In: Kuang, K., Sturdivant, R. (eds) RF and Microwave Microelectronics Packaging II. Springer, Cham. https://doi.org/10.1007/978-3-319-51697-4_4

Download citation

  • DOI: https://doi.org/10.1007/978-3-319-51697-4_4

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-51696-7

  • Online ISBN: 978-3-319-51697-4

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics

Search

Navigation