Abstract
Preferred orientation GaN films are deposited on freestanding thick diamond films by electron cyclotron resonance plasma enhanced metal organic chemical vapor deposition (ECR-PEMOCVD). The TMGa and N2 are applied as precursors and different N2 flux is used to achieve high quality GaN films. The influence of N2 flux on the properties of GaN films is systematically investigated by x-ray diffraction analysis (XRD), atomic force microscopy (AFM), electron probe microanalysis (EPMA) and Hall Effect Measurement (HL). The results show that the high quality GaN films deposited at the proper N2 flux display a fine structural and electrical property and the Ga/N atomic ratio plays an important role in the electrical property of GaN films.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
T. Shibata, Y. Kitamoto, K. Unno and E. Makino, J. Electrochem. Soc. 9 (2000), p. 47.
J.D. Hunn and C.P. Christensen, Solid State Technol. 37 (1994), p. 57.
M. Aslam and D. Schulz, Proc. 8th Int. Conf. Solid-State Sens. Actuators, Stockholm, Sweden, June 25–29 (1995), p. 222.
M.Y. Mao, T.P. Wang, J.F. Xie and W.Y. Wang, Proc. IEEE MEMS Workshop, Amsterdam, The Netherlands, Jan. 29–Feb. 2 (1995), p. 392.
T. Lamara, M. Belmahi, O. Elmazria, L. Le Brizoual, J. Bougdira, M. Remy and P. Alnot, Diamond Relat. Mater. 13 (2004), p. 581.
H. Nakahata, A. Hachigo, K. Higaki, S. Fujii, A. Hachigo, S. Shikata and N. Fujimori, IEEE Ultrason. Ferroelectr. Freq. Control 42 (1995), p. 362.
K. Yamanouchi, N. Sakurai and T. Satoh, IEEE Ultrason. Symp. (1989), p. 351.
S. Shikata, H. Nakahata, K. Higaki, A. Hachigo, N. Fujimori, Y. Yamamoto, N. Sakairi and Y. Takahashi, IEEE Ultrason. Symp. (1993), p. 277.
S. Shikata, H. Nakahata, A. Hachigo and N. Fujimori, Diamond Relat. Mater. 2 (1993), p. 1197.
H. Nakahata, H. Kitabayashi, T. Uemura, A. Hachigo, K. Higaki, S. Fujii and S. Shikata, IEEE Ultrason. Symp. Proc. (1998), p. 319.
T. Uemura, S. Fujii, H. Kitabayashi, K. Itakura, A. Hachigo, H. Nakahata and S. Shikata, Jpn. J. Appl. Phys. 41 (2002), p. 3476.
Jian SUN, Yi-Zhen BAI, Tian-Peng YANG, Jing-Chang SUN, Guo-Tong DU, Han-Hua WU Chin. Phys. Lett. 2006 23 1321
Jian SUN, Yi-Zhen BAI, Tian-Peng YANG, Jing-Chang SUN, Guo-Tong DU, Han-Hua WU Diam. Rel. Mater. 2007 16 1597
M. Aslam, G.S. Yang and A. Masood, Sens. Actuators, A, Phys. 45 (1994), p. 131.
M.Clement, L. Vergara, J. Sangrador Ultrasonics 42 (2004) 403–407
Wan Dreumel GWG et al 2009 Diam.Rel.Matter. 18 1043
Jin Z S et al Chin. Phys. Lett. 19 (2002) 1374
Bai Y Z et al Chin. Phys. Lett. 15 (1998) 228
C.-Y, HWANG, M.J. SCHURMAN and W.E. MAYD JOURNAL OF Electronic Materials 1997,26,3
Tansley, T.L. Egan, R.J. Phys.Lett.1995,66,1972
Glaser, E.R. Kennedy, T.A. Crookham, H.C. Fieitas, J.A. Khan, M.A. Olson, D.T. Kuznia, J.N. Appl.Phys.Lett.1993,63,2673.
Jenkins, D.W. Dow, J.D. Tsai, M.-H.J. Appl.Phys.1992,72,4130.
Jenkins, D.W. Dow, J.D. Phys.Rev.B 1989,39.3317
Maruska, H.P. Tietjen, J.J. Appl.Phys.Lett.1969,15,327.
C. Liu, A. Wenzel, J.W. Gerlach Surface and Coatings Technology 2000,128,455
R. NIBUHR, K.H. BACHEM, U. KAUFMANN. JOURNAL OF Electronic Materials 1997,26,10
Seifert, W. Franzheld, R. Butter, E. Sobotta, H. R. Butter, E. Sobotta, H. Reide, V. Cryst.Res.Technol.1983,18,383
Kuznia, J.N. Asif Khan, M. Olson, D.T. Kaplan, R. Freitas, J.A. Appl.Phys.1993,73,4700
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2013 TMS (The Minerals, Metals & Materials Society)
About this paper
Cite this paper
Zhenhe, J. et al. (2013). Structural and Electrical Properties of High C-Orientation Gan Films on Diamond Substrates with ECR-PEMOCVD. In: Marquis, F. (eds) Proceedings of the 8th Pacific Rim International Congress on Advanced Materials and Processing. Springer, Cham. https://doi.org/10.1007/978-3-319-48764-9_261
Download citation
DOI: https://doi.org/10.1007/978-3-319-48764-9_261
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-48586-7
Online ISBN: 978-3-319-48764-9
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)