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Non-destructive Evaluation of Biomaterial’s Magnetic Field After Plastic Deformation

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Information Technologies in Medicine (ITiB 2016)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 472))

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Abstract

The article deals with the non-destructive evaluation of conductive biomaterials. Various austenitic steel specimens are inspected under the same conditions. Residual weak magnetic field of the biomaterials is investigated. Commercial fluxgate sensor is used for the inspection. The gained results are presented and discussed in the paper. Biomaterials applied in the form of implants are under long-term mechanical stresses.

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Author information

Authors and Affiliations

  1. Faculty of Electrical Engineering, Department of Electromagnetic and Biomedical Engineering, University of Zilina, Univerzitna 1, 010 26, Zilina, Slovak Republic

    Milan Smetana, Vladimir Chudacik & Klara Capova

  2. Faculty of Mechanical Engineering, Department of Materials Engineering, University of Zilina, Univerzitna 1, 010 26, Zilina, Slovak Republic

    Monika Oravcova

Authors
  1. Milan Smetana
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  2. Vladimir Chudacik
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  3. Klara Capova
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  4. Monika Oravcova
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Corresponding author

Correspondence to Vladimir Chudacik .

Editor information

Editors and Affiliations

  1. Fac of Biomed Engg, ul. Roosevelta 40, Silesian University of Technology, Gliwice, Poland

    Ewa Piętka

  2. Fac of Biomed Engg, ul. Roosevelta 40, Silesian University of Technology, Gliwice, Poland

    Pawel Badura

  3. Faculty of Biomedical Engineering, Silesian University of Technology, Gliwice, Poland

    Jacek Kawa

  4. Faculty of Biomedical Engineering, Silesian University of Technology, Gliwice, Poland

    Wojciech Wieclawek

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© 2016 Springer International Publishing Switzerland

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Smetana, M., Chudacik, V., Capova, K., Oravcova, M. (2016). Non-destructive Evaluation of Biomaterial’s Magnetic Field After Plastic Deformation. In: Piętka, E., Badura, P., Kawa, J., Wieclawek, W. (eds) Information Technologies in Medicine. ITiB 2016. Advances in Intelligent Systems and Computing, vol 472. Springer, Cham. https://doi.org/10.1007/978-3-319-39904-1_35

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  • DOI: https://doi.org/10.1007/978-3-319-39904-1_35

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-39903-4

  • Online ISBN: 978-3-319-39904-1

  • eBook Packages: EngineeringEngineering (R0)

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