Abstract
According to the in-line inspection requirements of the surface mounted IC (integrated circuit) devices on the printed circuit board (PCB), an inspection algorithm based on the lead’s features was presented. Firstly, the features of the IC devices with different mounted quality under three colors (red, greed, blue) structure light source were analyzed. Secondly, the lead edge points were extracted with the first color derivative. Then the points were projected to avoid the difficulty of right thresholding. Based on the projections of the edges, the horizontal and vertical borders of the IC leads were obtained by the sliding location window algorithm. After location the leads, the defects such as missing devices, wrong devices, shifts and skews were inspected. Experiments results, from comparing with three existing method, show that our method possesses better performances both on efficiency and speed.
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Hui-hui, W., Sheng-lin, L. (2014). Research on Surface Mounted IC Devices Inspection Based on Lead’s Features*. In: Zhang, X., Liu, H., Chen, Z., Wang, N. (eds) Intelligent Robotics and Applications. ICIRA 2014. Lecture Notes in Computer Science(), vol 8918. Springer, Cham. https://doi.org/10.1007/978-3-319-13963-0_21
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DOI: https://doi.org/10.1007/978-3-319-13963-0_21
Publisher Name: Springer, Cham
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