Abstract
A compact and broadband rectangular waveguide-to-half mode substrate integrated waveguide (HMSIW) transition based on antisymmetric tapered probes is proposed. The antisymmetric tapered probes are used to change the quasi-TE0.5,0 mode in the HMSIW to the TE10 mode in the rectangular waveguide. To verify the proposed transition circuit, a back-to-back transition structure has been designed, fabricated and measured. The measured results show that an insertion loss less than 1.6 dB and a return loss better than 14 dB at 26–40 GHz are obtained for a back-to-back transition. Compared with the waveguide-to-HMSIW transition using antipodal fin-line, the size of the proposed transition circuit is reduced by approximately 71 %. The high performance, compact size and simple structure, enable such transition to be employed in a number of other millimeter-wave applications.
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References
He FF, Wu K, Hong W, Han L, Chen X-P (2012) Low-cost 60-GHz smart antenna receiver subsystem based on substrate integrated waveguide technology. IEEE Trans Microwave Theory Tech 60(4):1156–1165
Bozzi M, Georgiadis A, Wu K (2011) Review of substrate-integrated waveguide circuits and antennas. IET Microwave Antenna Propag 5(8):909–920
Hong W, Liu B, Wang Y, Lai Q, Tang H, Yin XX, Dong YD, Zhang Y, Wu K (2006) Half mode substrate integrated waveguide: a new guided wave structure for microwave and millimeter wave application. In: Proceedings of the joint 31st international conference, infrared millimeter waves 14th international conference terahertz electronics, Shanghai, p 219
Lai QH, Fumeaux C, Hong W, Vahldieck R (2009) Characterization of the propagation properties of the half-mode substrate integrated waveguide. IEEE Trans Microwave Theory Tech 57(8):1996–2004
Liu B, Hong W, Wang Y-Q, Lai Q-H, Wu K (2007) Half mode substrate integrated waveguide (HMSIW) 3 dB coupler. IEEE Microwave Wirel Compon Lett 17(1):22–24
Ho M-H, Li C-S (2013) Novel balanced BPF design using half-mode substrate integrated waveguide with common-mode suppression. Microwave Opt Technol Lett 55(5):1112–1115
Wu L-S, Xia B, Mao JF, Yin W-Y (2012) A half-mode substrate integrated waveguide ring for two-way power division of balanced circuit. IEEE Microwave Wirel Compon Lett 22(7):333–335
Senior DE, Cheng XY, Yoon Y-K (2012) Electrically tunable evanescent mode half-mode substrate-integrated-waveguide resonators. IEEE Microwave Wirel Compon Lett 22(3):123–125
Xia L, Xu R, Yan B, Li J, Guo Y, Wang J (2006) Broadband transition between air-filled waveguide and substrate integrated waveguide. Electron Lett 42(24):1403–1405
Zhong CL, Xu J, Zhi ZY (2009) Broadband substrate integrated waveguide to rectangular waveguide transition with fin-line. Electron Lett 45(4):205–207
Li J, Wen G, Xiao F (2010) Broadband transition between rectangular waveguide and substrate integrated waveguide. Electron Lett 46(3):223–224
Zhong CL, Xu J, Zhi ZY, Jin CX (2009) Broadband transition between half mode substrate integrated waveguide and rectangular waveguide. Electron Lett 45(3):168–170
Acknowledgments
This work was supported by the Fundamental Research Funds for the Central Universities of China (Grant No. ZYGX2012J030 and ZYGX2013J059).
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Dong, J., Yang, Z., Zhou, Y., Liu, Y., Yang, T. (2015). Compact Waveguide to HMSIW Transition Using Antisymmetric Tapered Probes. In: Mu, J., Liang, Q., Wang, W., Zhang, B., Pi, Y. (eds) The Proceedings of the Third International Conference on Communications, Signal Processing, and Systems. Lecture Notes in Electrical Engineering, vol 322. Springer, Cham. https://doi.org/10.1007/978-3-319-08991-1_85
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DOI: https://doi.org/10.1007/978-3-319-08991-1_85
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-08990-4
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