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Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements

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Recent Progress in Lead-Free Solder Technology

Part of the book series: Topics in Mining, Metallurgy and Materials Engineering ((TMMME))

Abstract

Intermetallic compound (IMC) growth is being analyzed due to its significant effect on solder joint reliability. It appears that from various works conducted whereby the excessive growth of IMC could lead to solder joint failure. Thus, many attempts have been made to determine the actual IMC thickness. Average values of IMC thickness are always used to represent the IMC layer. However, precise, and true representation of the IMC layer growth in the actual 3D phenomenon from 2D images remains unclear. Leading to this, the stereometry should be considered in determining the actual IMC thickness layer. The accuracy of the IMC layer thickness measurement is important as the IMC layer thickness values will be used for the next analysis such as for growth rate and activation energy calculation. Type of measurement to represent the actual IMC layer thickness based on 2D observation and nature of the IMC structure which contains hillocks and valleys is suggested.

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Acknowledgements

Authors would like to acknowledge Universiti Kebangsaan Malaysia for financial support (grant number GGPM-2019-056).

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Authors and Affiliations

  1. Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor, Malaysia

    M. A. Bakar, A. Jalar, A. Atiqah & N. Ismail

  2. Department of Applied Physics, Faculty of Science and Technology (FST), Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor, Malaysia

    A. Jalar & N. Ismail

Authors
  1. M. A. Bakar
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  2. A. Jalar
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  3. A. Atiqah
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  4. N. Ismail
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Corresponding author

Correspondence to M. A. Bakar .

Editor information

Editors and Affiliations

  1. Faculty of Chemical Engineering Techonology, Universiti Malaysia Perlis, Jejawi, Perlis, Malaysia

    Mohd Arif Anuar Mohd Salleh

  2. School of Mechanical Engineering, Universiti Sains Malaysia, Penang, Malaysia

    Mohd Sharizal Abdul Aziz

  3. Institute of Micro Engineering and Nanoelectronics, Universiti Kebangsaan Malaysia, UKM Bangi, Malaysia

    Azman Jalar

  4. Center of Excellence Geopolymer and Green Technology, Universiti Malaysia Perlis, Jejawi, Malaysia

    Mohd Izrul Izwan Ramli

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Bakar, M.A., Jalar, A., Atiqah, A., Ismail, N. (2022). Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements. In: Salleh, M.A.A.M., Abdul Aziz, M.S., Jalar, A., Izwan Ramli, M.I. (eds) Recent Progress in Lead-Free Solder Technology. Topics in Mining, Metallurgy and Materials Engineering. Springer, Cham. https://doi.org/10.1007/978-3-030-93441-5_11

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