Abstract
Nanocalorimetry has been developed and used to study the nucleation behavior of one single metallic droplet, especially the solidification undercooling. For heterogeneous nucleation, cooling rate and nucleation substrate are deemed as significant factors to affect the solidification undercooling. In this paper, the roles of cooling rate and substrate roughness in undercooling for the Sn droplet were comparatively studied. The Si thin film substrate was prepared by magnetron sputtering deposition technique with the deposition rate about 10 nm/min. Increasing the cooling rate from 50 to 104 K/s, the undercooling of the Sn droplet on the substrate was increased, followed by a gradually slow increment and then kept stable at high cooling rate. Besides, a roughness dependence of undercooling could also be observed at low cooling rate. The undercooling was increased with decreasing the roughness of the Si substrate, reflecting the nucleation acceleration by the large roughness for its favorable heat transfer.
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This work is supported by the National Natural Science Foundation of China (Grant no. 52071193).
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Li, S., Zhang, L., Zhao, B., Ding, K., Gao, Y. (2022). Cooling Rate and Roughness Dependence of the Undercooling for One Single Sn Droplet with Si Thin Film Substrate by Nanocalorimetry. In: Zhang, M., et al. Characterization of Minerals, Metals, and Materials 2022. The Minerals, Metals & Materials Series. Springer, Cham. https://doi.org/10.1007/978-3-030-92373-0_29
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