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Thermal Stress Analysis of IGBT Module Based on ANSYS

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Advances in Intelligent Automation and Soft Computing (IASC 2021)

Part of the book series: Lecture Notes on Data Engineering and Communications Technologies ((LNDECT,volume 80))

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Abstract

High power IGBT module is widely used in the field of rail transit, in which the module failure caused by overheating is the most common. In this paper, the cause of thermal stress in IGBT module is analyzed, and the three-dimensional finite element model of IGBT module packaging structure is established by using ANSYS software. Finally, the temperature field and stress distribution under the coupling effect of temperature field and structure field are obtained. The results show that the bonding wire is close to the chip with higher temperature, so it has higher thermal stress and is easy to fail.

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References

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Acknowledgments

The project was supported in part by Key-Area Research and Development Program of Guangdong Province under Grant 2018B010142001.

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Authors and Affiliations

  1. Key Laboratory of Reliability Physics and Application Technology of Electronic Components, No. 5 Institute of electronics, Ministry of Industry and Information Technology, Guangzhou, 510610, China

    Zhenwei Zhou & Linghui Meng

  2. School of Electrical Engineering, Henan University of Science and Technology, Luoyang, China

    Yanbei Sha

  3. Beijing Qiansiyu Electric Co., Ltd., Beijing, China

    Lu Wei

  4. School of Electrical Engineering, Beijing Jiaotong University, Beijing, China

    Mengxue Guo

Authors
  1. Zhenwei Zhou
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  2. Yanbei Sha
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  3. Lu Wei
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  4. Mengxue Guo
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  5. Linghui Meng
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Editor information

Editors and Affiliations

  1. Electronics and Computer Engineering Technology, Indiana State University, Terre Haute, IN, USA

    Xiaolong Li

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© 2022 The Author(s), under exclusive license to Springer Nature Switzerland AG

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Zhou, Z., Sha, Y., Wei, L., Guo, M., Meng, L. (2022). Thermal Stress Analysis of IGBT Module Based on ANSYS. In: Li, X. (eds) Advances in Intelligent Automation and Soft Computing. IASC 2021. Lecture Notes on Data Engineering and Communications Technologies, vol 80. Springer, Cham. https://doi.org/10.1007/978-3-030-81007-8_30

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