Abstract
This chapter describes the recent achievements in the enhancement of Bi − Te-based flexible thermoelectric generator (FlexTEG) devices. The requirement and excellent potential of FlexTEG devices was demonstrated in the context of cyber physical system (CPS) realized using the next-generation IoT technology. Our strategies pertaining to improvement in the performance of FlexTEGs were demonstrated and are described herein. It was found that the traditional semiconductor packaging technique is effective method to fabricate large-scale FlexTEG for use in energy harvesting on both planar and nonplanar surfaces. Flexible TEG module with substrate sizes 50 × 50 mm2 and 250 p − n pairs (thermoelectric couples) was successfully prepared. In addition, the findings of a bending test demonstrated that the flexible module is reliable and stable, with a maximum power output density of 158 mW/cm2 at ΔT = 105 K; these values correspond to conversion efficiency of 1.84%, which is comparable to that of conventional bulk TEG.
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Acknowledgment
This work was partially supported by the Programs for “Advancing Strategic Networks to Accelerate the Circulation of Talented Researchers” from Japan Society for the Promotion of Science (JSPS), and the programs of JST CREST (grantnumber: JP MJCR19J1), and “Dynamic Alliance for Open Innovation Bridging Human, Environment and Materials” in “Network Joint Research Center for Materials and Devices” from the Ministry of Education, Culture, Sports, Science and Technology of Japan (MEXT), and “Feasibility Study Program” from New Energy and industrial Technology Development Organization (NEDO). Thanks also to Noriko Kagami, Michio Okajima, Shutaro Nambu, and Professor Katsuaki Suganuma for their help and advice.
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Ekubaru, Y., Sugahara, T. (2021). Fabrication of High-Performance Flexible Thermoelectric Generators by Using Semiconductor Packaging Technologies. In: Skipidarov, S., Nikitin, M. (eds) Thin Film and Flexible Thermoelectric Generators, Devices and Sensors. Springer, Cham. https://doi.org/10.1007/978-3-030-45862-1_7
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DOI: https://doi.org/10.1007/978-3-030-45862-1_7
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