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Numerical Investigations of Ellipsoid Shaped Filler on Heat Transport Behavior of Reinforced Polymer Composites

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Advances in Engineering Research and Application (ICERA 2018)

Part of the book series: Lecture Notes in Networks and Systems ((LNNS,volume 63))

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Abstract

Nowadays polymers are the preferred as compared to their rivals due to many advantageous properties. These are mainly divided into two categories namely thermosets and thermoplastics. Epoxy, which is a thermoset polymer, can be used for the purpose of the heat transfer. Enhancement of the thermal conductivity of polymer material can be achieved with the copper filler having higher thermal conductivity. In this paper, a numerical study based on the finite element method is performed to determine the thermal conductivity of the polymer composite. The effective thermal conductivity of composite materials is investigated by considering the thermal conductivity ratio between a particle and the matrix material, with and without the thermal contact resistance and volume fraction. The results show that the effective thermal conductivity rises with an increase in filler volume fraction if the thermal contact resistance is ignored. It is also found that the thermal conductivity decreases gradually with the increase in thermal contact resistance. Moreover, the decrease of thermal conductivity dominates in case of higher volume fraction for higher thermal contact resistance.

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Authors and Affiliations

  1. Mechanical Engineering Department, Thapar Institute of Engineering and Technology, Patiala, 147001, Punjab, India

    Satnam Singh, Rohit Kumar Singla & Deepak Jain

Authors
  1. Satnam Singh
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  2. Rohit Kumar Singla
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  3. Deepak Jain
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Corresponding author

Correspondence to Rohit Kumar Singla .

Editor information

Editors and Affiliations

  1. Faculty of Software and Information Science, Iwate Prefectural University, Takizawa, Iwate, Japan

    Hamido Fujita

  2. Faculty of Electronic Engineering, Thai Nguyen University of Technology, Thai Nguyen, Vietnam

    Duy Cuong Nguyen

  3. Faculty of Mechanical Engineering, Thai Nguyen University of Technology, Thai Nguyen, Vietnam

    Ngoc Pi Vu

  4. Hanoi University of Science and technology, Hanoi, Vietnam

    Tien Long Banh

  5. Institute for Automation and Systems Engineering, Ilmenau University of Technology (TU Ilmenau), Ilmenau, Germany

    Hermann Horst Puta

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Singh, S., Singla, R.K., Jain, D. (2019). Numerical Investigations of Ellipsoid Shaped Filler on Heat Transport Behavior of Reinforced Polymer Composites. In: Fujita, H., Nguyen, D., Vu, N., Banh, T., Puta, H. (eds) Advances in Engineering Research and Application. ICERA 2018. Lecture Notes in Networks and Systems, vol 63. Springer, Cham. https://doi.org/10.1007/978-3-030-04792-4_53

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  • DOI: https://doi.org/10.1007/978-3-030-04792-4_53

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-04791-7

  • Online ISBN: 978-3-030-04792-4

  • eBook Packages: EngineeringEngineering (R0)

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