Abstract
Deposition of metals and alloys from aqueous solutions onto semiconductors and nonconductive surfaces, e.g., polymers, ceramics, and textiles, can be challenging. Direct electrodeposition of metals from aqueous solutions onto nonconductive surfaces is not practically successful. Using the physical vapor deposition (PVD) or chemical vapor deposition (CVD) in order to deposit various metals on semiconductors or nonconductors is usually quite successful. However, PVD and CVD processes are very expensive and require complicated equipment.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Similar content being viewed by others
References
Mallory O, Hajdu JB (1990) Electroless Plating: Fundamentals and Applications, AESFS, Orlando, Florida
Djokić SS (2002) Electroless Deposition of Metals and Alloys In: Conway BE, White RE and Bockris JO’M (eds), Modern Aspects of Electrochemistry, chap.2, no 35, Kluwer Academic/Plenum Publishers, New York p.51
Djokić SS, Cavallotti PL (2010) Electroless Deposition: Theory and Applications In: Djokić SS (ed) Electrodeposition: Theory and Practice, Modern Aspects of Electrochemistry, chap. 6, no 48, Springer, New York p.251
Sverin JW, Hokke R, van der Wel H, de With G (1993) J Electrochem Soc 140: 611
Charbonnier M, Alami M, Romand M (1996) J Electrochem Soc 143: 472
Dulcey CS, Georger Jr. JH, Krauthamer V, Stenger DA, Fare TL and Calvert JM (1991) Science 252: 551
Brandow SL, Dressick WJ, Marian CRK, Chow G-M and Calvert JM, J. Electrohem. Soc., 142 (1995) 2233
Deitz KH (1995) Plat and Surf Finish 82 (7): 60
Scudiero L, Fasasi A, Griffiths PR (2011) Appl Surf Sci 257:4422
Gorostiza P, Diaz R, Servat J. Sanz F, Morante JR (1997) J Electrochem Soc 144:909
Corraro C, Maboudian R, Magagnin L (2007) Surf Sci Rep 62(12):499.
Magagnin L, Bertani V, Cavallotti PL, Maboudian R, Carraro C (2002) Microelectr Eng 64:479
da Rosa CP, Maboudian R, Iglesia E (2008) J Electrochem Soc (155) (6):E70
Karmalker S, Sridhar D, Banerjee (1997) J Electrochem Soc 144:1696
Aizawa A, Cooper AM, Malac M, Buriak JM (2005) Nanolett 5:815
Djokić SS, Djokić NS (2011) J Electrochem Soc 158: D204
Djokić SS, Djokić NS, Guthy C, Thundat T (2013) Electrochim Acta 109: 475
Djokić SS (2012 Production of metallic Powders from Aqueous Solution Without an External Current Source In: Djokić SS (ed) Electrodeposition of Metal powders from Aqueous Solution, chap. 6, no 54, Springer, New York p.369
Magagnin L, Cojocaru P, Secundo F (2012) Electroless Synthesis of Metallic Nanostructures for Biomedical Technologies In: Djokić SS (ed) Biomedical Applications, chap. 2, no 55, Springer, New York p.73.
Uncuer M, Koser H (2012) J. Micromech. Microeng. 22:015003
Magagnin L, Maboudian R, Carraro C (2001) Electrochemical And Solid-State Letters 4:C5
Carraro C, Maboudian R, Magagnin L (2003) Thin Solid Films 434:100
Dongwook K, Bhimaraj P, Watts N, Isao Y, Kumar C, Youren X (2006) Evaluation of DIG (direct immersion gold) as a new surface finish for mobile applications In: 56th Proc. Electronic Components and Technology Conf., (Stoughton, WI: The Printing House, Inc.) p. 5
Youssef Sayed S, Wang F, Malac M, Li P, Wang D, Buriak J (2012) Cryst Eng Comm 14:5230
Fabre B, Hennous L, Ababou-Girard S, Meriadec C (2012) ACS Appl. Mater. Interfaces 5:338
Cerruti M, Doerk G, Hernandez G, Carraro C, Maboudian R (2009) Langmuir 26:432
Galvan-Arellano M, Diaz-Reyes J, Pena-Sierra R (2010) Vacuum 84:1195
Romann T, Anderson E, Kallip S, Mändar H, Matisen L, Lust E (2010) Thin Solid Films 518:3690
Kamp M, Bartsch J, Cimiotti G, Keding R, Zogaj A, Reichel C, Kalio A, Glatthaar M, Glunz S (2013) Solar Energy Materials and Solar Cells, in press. http://dx.doi.org/10.1016/j.solmat.2013.05.035
Chen GS, Chen ST, Lu YL (2010) Electrochemistry Communications 12:1483
Chaudhari VA, Solanki CS (2010) Solar Energy Materials & Solar Cells 94:2094
Kim D, Shanmugam R, Choi M, Yoo B (2012) Electrochimica Acta 75:42
Chen F, Shinosky M, Li B, Christiansen C, Lee T, Aitken J, Badami D, Huang E, Bonilla G, Ko T, Kane T, Wang Y, Zaitz M, Nicholson L, Angyal M, Truong C, Chen X, Yang G, Law SB, Tang TJ, Petitdidier S, Ribes G, Oh M, Child C, Sawada H, Kolics A, Rigoutat O, Gilbert N (2010) Comprehensive investigations of CoWP metal-cap impacts on low-k TDDB for 32 nm technology application In: Reliability Physics Symposium (IRPS), IEEE International (Anaheim, California) p.566
Inoue F, Shimizu T, Miyake H, Arima R, Ito T, Seki H, Shinozaki Y, Yamamoto T, Shingubara S (2013) Microelectronic Engineering 106:164
Tao Y, Hu A, Hang T, Peng L, Li M (2013) Applied Surface Science 282:632
Kawano M, Takahashi N, Komuro M, Matsui S (2010) Low-cost TSV process using electroless Ni plating for 3D stacked DRAM In: Electronic Components and Technology Conference (ECTC), Proceedings 60th (Las Vegas, USA) p. 1094
Han WK, Hwang GH, Hong SJ, An HH, Yoon CS, Kim JH, Lee MJ, Hong G, Park KS, Kang SG (2010) Materials Chemistry and Physics 123:401
Santagata F, Farriciello C, Fiorentino G, Wvan Zeijl H, Silvestri C, Zhang GQ, Sarro PM (2013) J. Micromech. Microeng. 23:055014
Akhtari-Zavareh A, Li W, Maroun F, Allongue P, Kavanagh KL (2013) Journal Of Applied Physics 113:063708
Lee JD, Kim HS, Jeong SY, Kim KH, Lee JJ, Kim JE (2010) Current Applied Physics 10:249
Nguyen D, Tanaka S, Nishino H, Manabe K, Ito S (2013) Nanoscale Research Letter 8:8
Pascu M, Nicolas D, Poncin-Epaillard F, Vasile C (2006) Journal Of Optoelectronics And Advanced Materials 8:1062
Cho SJ, Nguyen T, Boo J-H (2011) J. Nanosci. Nanotechnol. 11:5328
Borris J, Dohse A, Hinze A, Thomas M, Klages C-P, Mobius A, Elbick D, Weidlich E-R (2009) Plasma Process. Polym. 6-S258
Akamatsu K, Ikeda S, Nawafune H, Yanagimoto H, (2004) Journal of the American Chemical Society 126:10822
Yang F, Li P, Li X, Huo L, Chen J, Chen R, Na W, Tang W, Liang L, Su W (2013) Applied Surface Science 274:241
Sawada S, Masuda Y, Zhu P, Koumoto K, Langmuir (2006) 22-332
Miller MS, Filiatrault HL, Davidson GJE, Luo M, Carmichael TB (2010) Journal of the American Chemical Society 132:765
Tengsuwan S, Ohshima M (2012) J. of Supercritical Fluids 69-117
Djokić S et al. (1998) Electroless/electrolytic methods for the preparation of metallized ceramic substrate, US Patent 5,849,170A
Dearden J (1976) Electrocomp Sci Technol 3: 103
De Luca MA, McCormack JF (1986) Metallization of ceramics, US Patent 4,604,249
Osaka T, Asada T, Nakajima E, Koiwa I (1998), J Electrochem Soc 135: 2578
Shafeev GA (1993) Adv Mater for Opt and Electr 2: 183
Shafeev GA, Autric M, Marine V (1997) Adv Mater for Opt and Electr 7: 249
Nicholas G, Autric M, Marine, V Shafeev GA (1997) Appl Surf Sci 109-110: 128
Yanagimoto H, Akamatsu K, Deki S, Gotoh H (2003) J Electrochem Soc 150: C260
Gian PW, Shan X, Liang YN, Lok BK, Lu CW, Ooi BL (2008) EDA Publishing ISBN:978-2-35500-006-5
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2014 Springer Science+Business Media New York
About this chapter
Cite this chapter
Djokić, S.S., Magagnin, L. (2014). Metallization of Semiconductors and Nonconductive Surfaces from Aqueous Solutions. In: Djokić, S. (eds) Electrodeposition and Surface Finishing. Modern Aspects of Electrochemistry, vol 57. Springer, New York, NY. https://doi.org/10.1007/978-1-4939-0289-7_7
Download citation
DOI: https://doi.org/10.1007/978-1-4939-0289-7_7
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4939-0288-0
Online ISBN: 978-1-4939-0289-7
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)