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Copper Electrodepositon

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Copper Electrodeposition for Nanofabrication of Electronics Devices

Part of the book series: Nanostructure Science and Technology ((NST))

Abstract

Copper sulfate (CuSO4·5H2O) and sulfuric acid (H2SO4) are the primary constituents of the Acid copper sulfate bath [1]. The formulation of the bath is adjusted depending on the intended use, as given in Table 1.1.

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Author information

Authors and Affiliations

  1. Osaka Prefecture University, Osaka, Japan

    Masayuki Yokoi

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  1. Masayuki Yokoi
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Correspondence to Masayuki Yokoi .

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Editors and Affiliations

  1. Dept. of Chemical Engineering, Osaka Prefecture University, Osaka, Japan

    Kazuo Kondo

  2. Intel Corporation, Hillsboro, Oregon, USA

    Rohan N. Akolkar

  3. Dept. of Chemical Engineering, University of New Hampshire, Durham, New Hampshire, USA

    Dale P. Barkey

  4. Industrial Technology Support Institute, Osaka Prefecture, Japan

    Masayuki Yokoi

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Yokoi, M. (2014). Copper Electrodepositon. In: Kondo, K., Akolkar, R., Barkey, D., Yokoi, M. (eds) Copper Electrodeposition for Nanofabrication of Electronics Devices. Nanostructure Science and Technology. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9176-7_1

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