Skip to main content

Opto-Mechanical Characterization of a MEMS Sensor for Real-Time Infrared Imaging

  • Conference paper
  • First Online:
MEMS and Nanotechnology, Volume 6

Abstract

MEMS technology has led to the development of new uncooled infrared imaging detectors. These MEMS detectors consist of arrays of bi-metallic cantilevered beams that deflect linearly as a function of temperature associated with infrared radiation from the scene. The main advantage of these detectors is the optical readout system that measures the tilt of the beams based on the intensity reflected light. This removes the need for electronic readout at each of the sensing elements and reduces the fabrication cost and complexity of sensor design, as well as eliminating the electronic noise at the detector. The optical readout accuracy is sensitive to the uniformity of individual pixels on the array. The hypothesis of the present research is that direct measurements of the change in deflection will reduce the need for high pixel uniformity. Measurements of deflection change for a vacuum packaged detector with responsivity of 2.4 nm/K are made with a Linnik interferometer employing the four phase step technique. The interferometer can measure real-time, full-field height variations across the array. In double-exposure mode, the current height map is subtracted from a reference image so that the change in deflection is measured. A software algorithm locates each mirror on the array, extracts the measured deflection at the tip of a mirror, and uses that measurement to form a pixel of a thermogram in real-time. A blackbody target projector with temperature controllable to 0.001 K is used to test the thermal resolution of the imaging system. The minimum temperature resolution is below 250 mK.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 129.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Similar content being viewed by others

References

  1. Erdtman M, Simelgor G, Radhakrishan L, Zhang L, Liu Y, Emelie P, Salerno J (2010) Photomechanical imager FPA design for manufacturability. In: Proceedings of the SPIE, Infrared technology and applications XXXVI, Orlando, FL USA 7660:766017–766017-8

    Google Scholar 

  2. Dobrev I, Balboa M, Fossett R, Furlong C, Harrington E (2011) MEMS for real-time infrared imaging. In: Proceedings of the SEM, MEMS and nanotechnology, Uncasville, CT USA 4:119–125

    Google Scholar 

  3. Tripp E (2012) Interferometric optical readout system for a MEMS infrared imaging detector. MS thesis, Mechanical Engineering Department, Worcester Polytechnic Institute

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Everett Tripp .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2013 The Society for Experimental Mechanics

About this paper

Cite this paper

Tripp, E., Pantuso, F., Zhang, L., Harrington, E., Furlong, C. (2013). Opto-Mechanical Characterization of a MEMS Sensor for Real-Time Infrared Imaging. In: Shaw, G., Prorok, B., Starman, L. (eds) MEMS and Nanotechnology, Volume 6. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-4436-7_19

Download citation

  • DOI: https://doi.org/10.1007/978-1-4614-4436-7_19

  • Published:

  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-4435-0

  • Online ISBN: 978-1-4614-4436-7

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics