Abstract
This overview article will deal with a special application of the sputtering process, namely, the “magnetron sputtering technique.” In order to understand the underlying physical processes behind magnetron sputtering, a brief recapitulation of the sputtering phenomena will be given as a primary contribution of this article. Furthermore, the special concept of magnetron sputtering, from both a physical and a technical point of view, will be presented followed by some industrial applications, practical aspects, comparison with other PVD (“physical vapor deposition”) techniques, advantages and disadvantages, and finally some of the latest developments in the field, including future trends.
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Braun, M. (2013). Magnetron Sputtering Technique. In: Nee, A. (eds) Handbook of Manufacturing Engineering and Technology. Springer, London. https://doi.org/10.1007/978-1-4471-4976-7_28-9
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DOI: https://doi.org/10.1007/978-1-4471-4976-7_28-9
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