Abstract
In this chapter, we describe the architecture of an in-tire-pressure sensing system for automotive applications. Challenges are the supply of sufficient power, the proper functioning of the sensors (pressure, acceleration, and temperature), and a transceiver architecture with extremely low power consumption. Power consumption is reduced by use of a high-frequency resonator based on the bulk acoustic wave (BAW) technology. Such devices are used both in the transmit and in the receive paths. Further power-saving measures are taken introducing a specially adapted on/off cycling operation. The power supplied to the system is provided either by two small batteries or an energy scavenger, both capacitor buffered. The electronic system is integrated into 3D stacks using either through-silicon vias or the ultrathin chip stacking method to provide short interconnects for further reduced power consumption. The overall system is mounted in a compact molded interconnect device to save space and weight.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
A. El-Hoydi, J.D. Decotignie, in Proceedings of the International Symposium on Computers and Communications (ISCC), 2004, pp. 244–251
C.C. Enz, A. El-Hoiydi, J.D. Decotignie, T. Melly, V. Peiris, IEEE Comput. Mag. 37(8), 62 (2004)
J. Polastre, J. Hill, D. Culler, in SenSys, 2004
TDA5250 D2 ASK/FSK 868MHz Wireless Transceiver. Data sheet, Infineon Technologies AG (2007) http://www.infineon.com
TDK5100 ASK/FSK 868/433 MHz Wireless Transmitter. Data sheet, Infineon Technologies AG (2002) http://www.infineon.com
F.Z. Bi, B.P. Barber, IEEE Microw. Mag. 9(5), 65 (2008)
M. Flatscher, M. Dielacher, T. Herndl, T. Lentsch, R. Matischek, J. Prainsack, W. Pribyl, H. Theuss, W. Weber, IEEE J. Solid State Circ. 45(1), 167 (2010). DOI 10.1109/JSSC.2009.2034436
P. Ramm, A. Klumpp, R. Merkel, J. Weber, R. Wieland, A. Ostmann, J. Wolf, in MRS Symposium Proceedings 766, 2003, pp. 3–14
E. Beyne, in Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, vol. 2 (Wiley, Weinheim, 2008)
R. Aigner, in IEEE Custom Integrated Circuits Conference, 2003, pp. 141–146
M. Flatscher, M. Dielacher, T. Herndl, T. Lentsch, R. Matischek, J. Prainsack, W. Pribyl, H. Theuss, W. Weber, in International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2009, pp. 286–287
J. Prainsack, M. Dielacher, M. Flatscher, T. Herndl, R. Matischek, J. Stolle, W. Weber, in Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2009, pp. 81–85
M. Dielacher, M. Flatscher, W. Pribyl, in Research in Microelectronics and Electronics PRIME, 2009, pp. 172–175
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2013 Springer Science+Business Media New York
About this chapter
Cite this chapter
Dielacher, M. et al. (2013). A Robust Wireless Sensor Node for In-Tire-Pressure Monitoring. In: Enz, C., Kaiser, A. (eds) MEMS-based Circuits and Systems for Wireless Communication. Integrated Circuits and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-8798-3_12
Download citation
DOI: https://doi.org/10.1007/978-1-4419-8798-3_12
Published:
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4419-8797-6
Online ISBN: 978-1-4419-8798-3
eBook Packages: EngineeringEngineering (R0)