Abstract
Flip chip, as the name implies, is a means of chip assembly whereby the chip is attached face down (active Integrated Circuit (IC) side down) to the substrate. Flip chip technology was invented by IBM in 1961 and is now 51 years old. This development allowed IBM to be the leader in producing high performance circuits. The method for production that IBM employed was expensive and limited its widespread use. IBM kept this technology captive until the mid 1990s. As it is well known IBM created the technology for its advanced computing needs. This technology utilized ceramic carriers and was suitable for high power dissipation. Although the original “controlled collapse chip connection,” also known as (C4), concept utilized solder coated copper balls to form the interconnect, high lead (97/3) solder evaporated through a molybdenum stencil became the staple of the technology for decades. IBM kept this technology captive, and the intellectual property (IP) protected and secret for many years past the original Patents useful lifetime.
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References
Chip Scale Review (2001) Wafer bumping tutorial by Robert Lanzone
Amkor Technology Inc. various Company Technology presentations
Chipworks tear down reports
TechSearch International Inc (2010) Flip chip report
ECTC 2011—Next Generation Fine Pitch Cu Pillar Technology—Enabling Next Generation Silicon Nodes Mark Gerber, Craig Beddingfield, and Shawn O’Connor, Texas Instruments Inc., 13532 N. Central Expressway, Dallas, TX 75243, USA; Min Yoo, MinJae Lee, DaeByoung Kang, and SungSu Park, Amkor Technology Korea, 280-8, 2-ga, Sungsu-dong, Sundong-gu, Seoul 133-706, Korea; Curtis Zwenger, Robert Darveaux, Robert Lanzone, and KyungRok Park, Amkor Technology Inc., 1900 South Price Road, Chandler, AZ 85286, USA
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© 2013 Springer Science+Business Media New York
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Lanzone, R. (2013). Market Trends: Past, Present, and Future. In: Tong, HM., Lai, YS., Wong, C. (eds) Advanced Flip Chip Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5768-9_1
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DOI: https://doi.org/10.1007/978-1-4419-5768-9_1
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