Overview
- Useful technique for packaging process control and analysis
- Includes supplementary material: sn.pub/extras
Part of the book series: Microtechnology and MEMS (MEMS)
Access this book
Tax calculation will be finalised at checkout
Other ways to access
Table of contents (6 chapters)
-
Front Matter
-
Back Matter
Keywords
About this book
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Authors and Affiliations
Bibliographic Information
Book Title: Force Sensors for Microelectronic Packaging Applications
Authors: Jürg Schwizer, Michael Mayer, Oliver Brand
Series Title: Microtechnology and MEMS
DOI: https://doi.org/10.1007/b138345
Publisher: Springer Berlin, Heidelberg
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: Springer-Verlag Berlin Heidelberg 2005
Hardcover ISBN: 978-3-540-22187-6Published: 21 October 2004
Softcover ISBN: 978-3-642-06063-2Published: 22 October 2010
eBook ISBN: 978-3-540-26945-8Published: 11 December 2005
Series ISSN: 1615-8326
Series E-ISSN: 2365-0680
Edition Number: 1
Number of Pages: VIII, 178
Topics: Nanotechnology, Optical and Electronic Materials, Engineering, general, Quality Control, Reliability, Safety and Risk, Electronics and Microelectronics, Instrumentation