PCM-Enhanced Building Components

1. Front Matter

   Pages i-xv

   PDF

2. Introduction

   • Jan Kośny

   Pages 1-19

3. Short History of PCM Applications in Building Envelopes

   • Jan Kośny

   Pages 21-59

4. Overview of Basic Solid–Liquid PCMs Used in Building Envelopes—Packaging Methods, Encapsulation, and Thermal Enhancement

   • Jan Kośny

   Pages 61-105

5. Laboratory Thermal Testing of PCM-Enhanced Building Products and Envelope Systems

   • Jan Kośny

   Pages 107-141

6. Examples of Full-Scale Field Experiments—Test Huts and Whole Buildings Containing PCM-Enhanced Building Envelope Components

   • Jan Kośny

   Pages 143-166

7. Thermal and Energy Modeling of PCM-Enhanced Building Envelopes

   • Jan Kośny

   Pages 167-234

8. Basic Building Envelope Products Containing PCM and Related Patents

   • Jan Kośny

   Pages 235-271

Presenting an overview of the use of Phase Change Materials (PCMs) within buildings, this book discusses the performance of PCM-enhanced building envelopes. It reviews the most common PCMs suitable for building applications, and discusses PCM encapsulation and packaging methods. In addition to this, it examines a range of PCM-enhanced building products in the process of development as well as examples of whole-building-scale field demonstrations. Further chapters discuss experimental and theoretical analyses (including available software) to determine dynamic thermal and energy performance characteristics of building enclosure components containing PCMs, and present different laboratory and field testing methods. Finally, a wide range of PCM building products are presented which are commercially available worldwide. This book is intended for students and researchers of mechanical, architectural and civil engineering and postgraduate students of energy analysis, dynamic design of building structures, and dynamic testing procedures. It also provides a useful resource for professionals involved in architectural and mechanical-civil engineering design, thermal testing and PCM manufacturing.

• Building Envelopes and Internal Structures
• Dynamic Thermal Performance
• Heat Transfer in Buildings
• Phase Change Materials
• Thermal Design of Building Enclosures

• Fraunhofer Center for Sustainable Energy Systems CSE, Boston, USA

  Jan Kośny

Dr. Jan Kosny, a winner of a 2009 R&D 100 Award for the development of phase-change materials, is one the world’s leading building envelope researchers with over 30 years experiences in the building sciences.  Prior to joining Fraunhofer CSE, Dr. Kosny spent 18 years at Oak Ridge National Laboratory where he developed a number of high-performance wall, roofing, and BIPV concepts.  Holding a number of faculty positions, he has published over 120 technical articles and numerous patents related to advanced building concepts.  He has represented the United States at many international organizations and standards bodies including the International Energy Agency.  He has extensive experience collaborating with industry to commercialize advanced building technologies. From 2002 to 2004, while at Oak Ridge National Laboratory (ORNL) he developed the first ever dynamic thermal insulation – PCM-enhanced cellulose insulation. In 2009 this material became commercially available on the U.S. building market. In 2007, this development was followed by a similar technology using blown fiberglass. Currently, US Army is performing a renovation of military buildings using this material - $2-mln. project was established for this purpose. Currently Dr. Kosny leads the Building Enclosure Program at the Fraunhofer Center for Sustainable Energy Systems in Cambridge, MA, USA.

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