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Thermal Sensors

Principles and Applications for Semiconductor Industries

  • Book
  • © 2015

Overview

  • Treats both theoretical and practical aspects of thermal sensors and their applications
  • Demonstrates the range of thermal sensor capabilities in industry
  • Offers a complete overview of thermal sensor design and functionality
  • Includes supplementary material: sn.pub/extras

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Table of contents (6 chapters)

Keywords

About this book

This book is a comprehensive guide to both the fundamentals of thermal sensors and their advanced functions. Key topics include sensor materials, CMOS-compatible sensors, measurement capabilities, thermal management and manufacturing processes. The introductory chapter covers the basic principles of thermal sensors from the essentials of heat transfer to smart wireless sensors. Later chapters illustrate the wide range of thermal sensor uses, from microprocessor thermal sensing to energy converter applications. Modeling and simulation techniques are used to explain the future direction of the field. Designed for researchers and practitioners working with wireless sensors and thermal management, Thermal Sensors: Principles and Applications for Semiconductor Industries is a valuable reference to the benefits and challenges these sensors offer. Advanced-level students studying mechanical or electrical engineering and networks will also find the content useful.

Editors and Affiliations

  • Intel Corporation, Chandler, USA

    Chandra Mohan Jha

Bibliographic Information

  • Book Title: Thermal Sensors

  • Book Subtitle: Principles and Applications for Semiconductor Industries

  • Editors: Chandra Mohan Jha

  • DOI: https://doi.org/10.1007/978-1-4939-2581-0

  • Publisher: Springer New York, NY

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Science+Business Media New York 2015

  • Hardcover ISBN: 978-1-4939-2580-3

  • Softcover ISBN: 978-1-4939-4963-2

  • eBook ISBN: 978-1-4939-2581-0

  • Edition Number: 1

  • Number of Pages: VII, 134

  • Number of Illustrations: 89 b/w illustrations

  • Topics: Circuits and Systems, Engineering Thermodynamics, Heat and Mass Transfer, Simulation and Modeling

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