Authors:
- Describes power distribution systems and related design problems, including both circuit models and design techniques to allocate on-chip decoupling capacitors
- Details effects of inductance on impedance characteristics of on-chip power distribution grids
- Includes new material on inductance models for interdigitated structures, design strategies for multi-layer power grid networks, and advanced algorithms for computational power grid analysis
- Includes supplementary material: sn.pub/extras
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Table of contents (31 chapters)
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Front Matter
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Noise in Power Distribution Networks
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Front Matter
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About this book
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems.
Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Authors and Affiliations
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University of Rochester, Rochester, USA
Renatas Jakushokas, Selçuk Köse, Eby G. Friedman
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Qualcomm Incorporated, San Diego, USA
Mikhail Popovich
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Intel Corporation, Hillsboro, USA
Andrey V. Mezhiba
Bibliographic Information
Book Title: Power Distribution Networks with On-Chip Decoupling Capacitors
Authors: Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
DOI: https://doi.org/10.1007/978-1-4419-7871-4
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2011
Softcover ISBN: 978-1-4899-8232-2
eBook ISBN: 978-1-4419-7871-4
Edition Number: 2
Number of Pages: XXV, 644
Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures