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Silicon Carbide Microsystems for Harsh Environments

  • Book
  • © 2011

Overview

Authors:
  1. Muthu B.J. Wijesundara

    1. , Automation and Robotics Research Institu, The University of Texas at Arlington, Arlington, USA

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  2. Robert Azevedo

    1. Redwood City, USA

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  • Addresses the SiC platform for complete microsystems and goes beyond the individual device level. -Covers state-of-the-art SiC electronics
  • Provides a comprehensive collection of SiC technologies information relevant to harsh environment microsystems
  • Covers the challenges in combining SiC process and components to a microsystem
  • Discusses power source and signal transmission issues in the context of the harsh environment application space
  • Includes supplementary material: sn.pub/extras

Part of the book series: MEMS Reference Shelf (MEMSRS, volume 22)

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Table of contents (6 chapters)

  1. Front Matter

    Pages i-xv
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  2. Introduction

    • Muthu B. J. Wijesundara, Robert G. Azevedo
    Pages 1-32

  3. SiC Materials and Processing Technology

    • Muthu B. J. Wijesundara, Robert G. Azevedo
    Pages 33-95

  4. Silicon Carbide Electronics

    • Muthu B. J. Wijesundara, Robert G. Azevedo
    Pages 97-124

  5. SiC MEMS devices

    • Muthu B. J. Wijesundara, Robert G. Azevedo
    Pages 125-165

  6. Packaging

    • Muthu B. J. Wijesundara, Robert G. Azevedo
    Pages 167-188

  7. System Integration

    • Muthu B. J. Wijesundara, Robert G. Azevedo
    Pages 189-230

  8. Back Matter

    Pages 231-232
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Keywords

About this book

Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.

Authors and Affiliations

  • , Automation and Robotics Research Institu, The University of Texas at Arlington, Arlington, USA

    Muthu B.J. Wijesundara

  • Redwood City, USA

    Robert Azevedo

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