Overview
- Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS
- Discusses specific MEMS fabrication techniques that fall into three primary categories: Additive, Subtractive, Lithography/patterning, as well as wafer Bonding, Doping, Surface Treatment/preparation, and Characterization Techniques
- Provides the reader with a quick check list of the advantage/disadvantage of fabrication
- Includes supplementary material: sn.pub/extras
Part of the book series: MEMS Reference Shelf (MEMSRS, volume 1)
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Table of contents (14 chapters)
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Front Matter
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Back Matter
About this book
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Reviews
From the reviews:
“In this handbook, editors Ghodssi (Univ. of Maryland, College Park) and Lin (Touch Micro-system Technology, Taiwan) have essentially organized the collective knowledge of decades of MEMS research from around the world into one book. … This volume is not designed as a textbook, but instead as a reference, and is extremely useful for MEMS inventors. Summing Up: Highly recommended. Graduate students, researchers/faculty, and professionals.” (N. M. Fahrenkopf, Choice, Vol. 49 (2), October, 2011)Editors and Affiliations
Bibliographic Information
Book Title: MEMS Materials and Processes Handbook
Editors: Reza Ghodssi, Pinyen Lin
Series Title: MEMS Reference Shelf
DOI: https://doi.org/10.1007/978-0-387-47318-5
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2011
Hardcover ISBN: 978-0-387-47316-1Published: 06 April 2011
eBook ISBN: 978-0-387-47318-5Published: 18 March 2011
Series ISSN: 1936-4407
Series E-ISSN: 1936-4415
Edition Number: 1
Number of Pages: XXXVI, 1188
Topics: Electronics and Microelectronics, Instrumentation, Materials Science, general, Circuits and Systems, Surfaces and Interfaces, Thin Films